Substrates for electronic device fabrication and methods thereof. A reusable substrate with at least a plurality of grooves for electronic device fabrication includes a substrate body made of one or more substrate materials and including a top planar surface, the top planar surface being divided into a plurality of planer regions by the plurality of grooves, the plurality of grooves including a plurality of bottom planar surfaces. Each of the plurality of grooves includes a bottom planar surface and two side surfaces, the bottom planar surface being selected from the plurality of bottom planar surfaces, the two side surfaces being in contact with the top surface and the bottom surface. The bottom planar surface is associated with a groove width from one of the two side surfaces to the other of the two side surfaces, the groove width ranging from 0.1 μm to 5 mm.
Lux Material Sep 2011 - Jun 2014
Process Engineer
Hit Sep 2011 - Jun 2014
Teacher
Alta Devices Sep 2009 - Sep 2011
Member of Technical Staff
Svtc Jun 2007 - Nov 2008
Staff Engineer
Cypress Semiconductor Corporation Jun 2006 - Dec 2006
Cmp Engineer
Education:
University of Nevada, Reno 1996 - 2000
Doctorates, Doctor of Philosophy, Metallurgical Engineering, Philosophy
Skills:
Semiconductors Silicon Thin Films Spc Process Simulation Etching Materials Failure Analysis Cmp Semiconductor Industry Electroplating Characterization Plasma Physics Metrology Solar Energy Gaas Substrate Afm