Aaron J Stein

US Patent:

8413320, Apr 9, 2013

Filed:

Jan 28, 2011

Appl. No.:

13/016316

Inventors:

Paul B. Hafeli - Ventura CA, US
Eli Holzman - Thousand Oaks CA, US
Aaron J. Stein - Santa Barbara CA, US
Michael Vargas - Goleta CA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H01R 43/00

US Classification:

29825, 29840, 22818022, 228264

Abstract:

In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.

US Patent:

8522426, Sep 3, 2013

Filed:

Jun 5, 2010

Appl. No.:

12/794735

Inventors:

Robert H. Dennis - Haverhill MA, US
Amanda Loehr - Tucson AZ, US
Robert E. Morris - Tucson AZ, US
Peter D. Patalano - North Chelmsford MA, US
Aaron J. Stein - Santa Barbara CA, US
John Stephens - Oxnard CA, US
Harold L. Wieck - Tucson AZ, US
Eli Holzman - Thousand Oaks CA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H05K 3/34
H05K 3/20
H05K 3/30
H05K 3/00
H01R 9/00
H01K 3/10
B29C 65/00
B32B 37/00
G05G 15/00

US Classification:

29840, 29831, 29832, 29843, 29852, 156349

Abstract:

A vented BGA package is reconfigured by first applying a continuous bead of adhesive around the perimeter of the package to seal the gap between the lid and substrate. The continuous bead defines a channel through the pressure relief vents to a polarity through-hole in the lid. The BGA package is reflow soldered to a PWB at an elevated temperature using solder flux, clean or no-clean. The IC die achieves elevated temperature pressure relief through the pressure relief vents along the channel and out the polarity through-hole. After reflow a seal is applied to plug the polarity through-hole. The PWB is washed in an aqueous cleaner solution to remove flux residue. The continuous bead of adhesive and the seal form a cleaner solution barrier that prevents the solution from contacting conductors inside the package. The seal may be removed or left intact depending on the operating environment.

US Patent:

20130186942, Jul 25, 2013

Filed:

Mar 11, 2013

Appl. No.:

13/793846

Inventors:

RAYTHEON COMPANY - Waltham MA, US
Eli Holzman - Thousand Oaks CA, US
Aaron J. Stein - Santa Barbara CA, US
Michael Vargas - Goleta CA, US

Assignee:

RAYTHEON COMPANY - Waltham MA

International Classification:

B23K 31/02

US Classification:

228176

Abstract:

In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.