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Aaron J Zilkie

age ~46

from Pasadena, CA

Also known as:
  • Aaron John Zilkie
  • Aaron Zilke
Phone and address:
2190 Paloma St, Pasadena, CA 91104
(213)8808610

Aaron Zilkie Phones & Addresses

  • 2190 Paloma St, Pasadena, CA 91104 • (213)8808610
  • Painted Post, NY
  • Horseheads, NY
  • Chino, CA

Work

  • Company:
    Rockley photonics inc.
    Dec 31, 2013
  • Position:
    Co-founder and vice president of engineering

Education

  • Degree:
    Ph.D.
  • School / High School:
    University of Toronto
    2003 to 2008
  • Specialities:
    Electrical Engineering (Photonics)

Skills

Optoelectronics • Fiber Optics • Semiconductors • Optical Communications • Labview • Silicon Photonics

Languages

English

Interests

Hiking and Camping • Curling • Art • City • Re/Max Executives Realty • Photonics • Golf • Sci Fi Movie • Contact • Community • History • Rheanne Unryn • Nasas Curiosity Mars Rover • Skiing • Real Estate Service • Baseball • Book • Piano • Action • Artist • Local Business • Classical (Music) • Public Toilet • Musician/Band • Beach Volleyball • Philsophy • Fareed Zakaria • Team Israel • Trombone • Sports on Facebook • Movie Genre • Journalist • A Brief History of Time • Coldplay • Musical Instrument • World Economics • Sports Team • Concentration Or Major • Musical Genre • Documentaries • Sport • Traveling • Hans Zimmer • Science • Jazz • Aerospace Company • Angels and Demons • Tennis • Interest

Industries

Semiconductors

Resumes

Aaron Zilkie Photo 1

Co-Founder And Vice President Of Engineering

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Location:
2190 Paloma St, Pasadena, CA 91104
Industry:
Semiconductors
Work:
Rockley Photonics Inc.
Co-Founder and Vice President of Engineering

Kotura, Inc. Jul 2011 - Sep 2013
Program Manager and Senior Engineer

Oclaro Mar 2008 - Jul 2011
Senior Optical Engineer

University of Toronto Jan 2004 - Mar 2008
Research Assistant

Nortel Sep 1999 - Aug 2001
Full-Time Engineer and Engineering Intern
Education:
University of Toronto 2003 - 2008
Ph.D., Electrical Engineering (Photonics)
University of Toronto 2001 - 2003
M.A.Sc, Electrical Engineering (Photonics)
University of Manitoba 1996 - 2001
B.Sc., Electrical and Computer Engineering
Skills:
Optoelectronics
Fiber Optics
Semiconductors
Optical Communications
Labview
Silicon Photonics
Interests:
Hiking and Camping
Curling
Art
City
Re/Max Executives Realty
Photonics
Golf
Sci Fi Movie
Contact
Community
History
Rheanne Unryn
Nasas Curiosity Mars Rover
Skiing
Real Estate Service
Baseball
Book
Piano
Action
Artist
Local Business
Classical (Music)
Public Toilet
Musician/Band
Beach Volleyball
Philsophy
Fareed Zakaria
Team Israel
Trombone
Sports on Facebook
Movie Genre
Journalist
A Brief History of Time
Coldplay
Musical Instrument
World Economics
Sports Team
Concentration Or Major
Musical Genre
Documentaries
Sport
Traveling
Hans Zimmer
Science
Jazz
Aerospace Company
Angels and Demons
Tennis
Interest
Languages:
English

Us Patents

  • Tunable Dispersion Compensator Configured For Continuous Setpoint Control

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  • US Patent:
    20110249979, Oct 13, 2011
  • Filed:
    Apr 9, 2010
  • Appl. No.:
    12/757712
  • Inventors:
    Lan Sheng - Painted Post NY, US
    Aaron Zilkie - Painted Post NY, US
    Mark Summa - Painted Post NY, US
    Timothy Kent Zahnley - Spencer NY, US
    Peter G. Wigley - Corning NY, US
  • International Classification:
    H04B 10/00
    G02F 1/01
  • US Classification:
    398159, 359260, 359238
  • Abstract:
    A tunable dispersion compensator (TDC) is tuned from a first dispersion setpoint to a second dispersion setpoint while maintaining continuity of the dispersion. The dispersion tuning follows a pre-determined trajectory in the time domain, so that continuity of the optical dispersion across the channel optical bandwidth is maintained while minimizing all other TDC-induced optical impairments during a tuning period
  • Tunable Optical Filters Using Cascaded Etalons

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  • US Patent:
    20120075636, Mar 29, 2012
  • Filed:
    Sep 23, 2010
  • Appl. No.:
    12/924218
  • Inventors:
    Aaron J. Zilkie - Painted Post NY, US
  • International Classification:
    G01B 9/02
  • US Classification:
    356454
  • Abstract:
    A temperature-tuned dielectric-slab-etalon scanning spectrometer that is low cost and simple to fabricate uses cascaded etalon modules, each module comprising a Fabry-Perot (FP) etalon having a relatively small Free Spectral Range (FSR), with at least two modules provided with a temperature control. According to the invention, the multiple FP modules produce Vernier tuning control. In these devices, the tuning temperature range is typically less than 10 C., and the required slab thickness may be less than 1 mm. This reduces fabrication and material requirements, and results in lower device cost and improved reliability.
  • Tunable Optical Filters With Liquid Crystal Resonators

    view source
  • US Patent:
    20120268709, Oct 25, 2012
  • Filed:
    Apr 20, 2011
  • Appl. No.:
    13/091103
  • Inventors:
    Aaron J. Zilkie - Painted Post NY, US
    Atul Pradhan - Pittsford NY, US
  • International Classification:
    G02F 1/13
  • US Classification:
    349198
  • Abstract:
    A voltage-tuned optical filter that is low cost and simple to fabricate uses cascaded etalon modules, each module comprising a liquid crystal etalon, such as a Fabry-Perot etalon, having a relatively small Free Spectral Range (FSR). At least two of the modules are provided with a voltage control to enable Vernier tuning control. For a given overall scan, the voltage-tuned optical filter may operate with reduced voltage ranges for each liquid crystal etalon.
  • Optical Out-Coupler Unit For Out-Coupling Light From A Waveguide

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  • US Patent:
    20220365280, Nov 17, 2022
  • Filed:
    May 13, 2022
  • Appl. No.:
    17/744108
  • Inventors:
    - Altrincham, GB
    Iain ANTENEY - Newport, GB
    Jeffrey DRISCOLL - San Jose CA, US
    Alexander GONDARENKO - San Jose CA, US
    Dhiraj KUMAR - Redondo Beach CA, US
    Abu THOMAS - Oak Park CA, US
    Andrea TRITA - Pasadena CA, US
    Aaron John ZILKIE - Pasadena CA, US
  • International Classification:
    G02B 6/26
  • Abstract:
    An optical out-coupler unit for out-coupling light from a waveguide, comprising a substrate having a planar top surface, a waveguide arranged on the top surface of the substrate and having a facet, a reflective surface, wherein the reflective surface is arranged spaced apart from the facet and opposing the facet, wherein the reflective surface is inclined with respect to a normal to the top surface of the substrate by more than 45. The optical out-coupler may be part of a photonic integrated chip (PIC).
  • Method, Device Wafer, And Optoelectronic Device

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  • US Patent:
    20220367750, Nov 17, 2022
  • Filed:
    Apr 29, 2022
  • Appl. No.:
    17/733947
  • Inventors:
    - Altrincham, GB
    Mohamad DERNAIKA - Cork, IE
    Ludovic CARO - Cork, IE
    Hua YANG - Cork, IE
    Aaron John ZILKIE - Pasadena CA, US
  • International Classification:
    H01L 33/00
    H01L 31/18
  • Abstract:
    A method of preparing a device coupon for a micro-transfer printing process from a multi-layered stack located on a device wafer substrate. The multi-layered stack comprises a plurality of semiconductor layers. The method comprises steps of: (a) etching the multi-layered stack to form a multi-layered device coupon, including an optical component; and (b) etching a semiconductor layer of the multi-layered device coupon to form one or more tethers, said tethers securing the multi-layered device coupon to one or more supports.
  • Method For Iii-V/Silicon Hybrid Integration

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  • US Patent:
    20220357509, Nov 10, 2022
  • Filed:
    Jul 5, 2022
  • Appl. No.:
    17/858021
  • Inventors:
    - Altrincham, GB
    Mohamad DERNAIKA - Cork, IE
    Ludovic CARO - Cork, IE
    Hua YANG - Cork, IE
    Aaron John ZILKIE - Pasadena CA, US
  • International Classification:
    G02B 6/13
    H01L 21/677
    H01L 21/68
    H01L 23/544
    H01L 25/16
  • Abstract:
    A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.
  • Method For Iii-V/Silicon Hybrid Integration

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  • US Patent:
    20220334329, Oct 20, 2022
  • Filed:
    Jul 1, 2022
  • Appl. No.:
    17/856864
  • Inventors:
    - Altrincham, GB
    Mohamad DERNAIKA - Cork, IE
    Ludovic CARO - Cork, IE
    Hua YANG - Cork, IE
    Aaron John ZILKIE - Pasadena CA, US
  • International Classification:
    G02B 6/42
    G02B 6/136
    H01S 5/02326
  • Abstract:
    A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.
  • Phase Shift Keying Modulator

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  • US Patent:
    20220326588, Oct 13, 2022
  • Filed:
    May 2, 2022
  • Appl. No.:
    17/734962
  • Inventors:
    - Altrincham, GB
    Aaron John ZILKIE - Pasadena CA, US
    Frank PETERS - Cork, IE
  • International Classification:
    G02F 1/225
    G02F 1/21
  • Abstract:
    A phase shift keying modulator. The modulator comprises: a plurality of silicon waveguides provided in a device layer of a silicon-on-insulator platform, the silicon-on-insulator platform including one or more cavities; one or more III-V semiconductor based devices located within the one or more cavities of the silicon-on-insulator platform, each III-V semiconductor-based device including a III-V semiconductor based waveguide which is coupled at an input end to one of the plurality of silicon waveguides and coupled at an output end to another of the plurality of silicon waveguides, each III-V semiconductor based waveguide comprising an active phase modulating portion; and one or more contacts in electrical contact with each active phase modulating portion, such that the phase shift keying modulator is operable to modulate the phase of an optical wave passing through each active phase modulating portion.

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