Alex T Berger

US Patent:

6398823, Jun 4, 2002

Filed:

Dec 7, 1999

Appl. No.:

09/456094

Inventors:

Oleg Siniaguine - San Jose CA
Alex Berger - Sunnyvale CA

Assignee:

Tru-Si Technologies, Inc. - Sunnyvale CA

International Classification:

H01L 2100

US Classification:

29 2501, 414935

Abstract:

The present invention comprises a dynamic brake that applies restraining frictional force to a wafer in a wafer holder while the wafer holder is substantially at rest, but releases the restraining force as the processing carousel containing several wafer holders rotates about a central axis of the carousel. This dynamic brake preferably comprises a boot that passes through an opening in the wafer holder to rest on the surface of the wafer in an exclusion zone near the wafers edge. The exclusion zone is typically no more than about 3mm in extent. The frictional force between the boot and wafer is sufficient to prevent unwanted motion of the wafer in the holder. As the wafer holder rotates about a central axis of the processing carousel, centrifugal forces applied to the brake arising from such rotation cause the boot to pivot upward, releasing the frictional force on the wafer.

US Patent:

6402843, Jun 11, 2002

Filed:

Dec 7, 1999

Appl. No.:

09/456135

Inventors:

Oleg Siniaguine - San Jose CA
Sergey Savastiouk - San Jose CA
Alex Berger - Palo Alto CA
Igor Bagriy - Sunnyvale CA

Assignee:

TruSi Technologies, LLC - Sunnyvale CA

International Classification:

C23C 1600

US Classification:

118500, 118728, 156345, 269 21

Abstract:

The present invention relates to a non-contact holder for substantially planar workpieces, particularly suited for holding thin workpieces without substantial distortion. The present invention includes a cylindrical chuck having a gas inlet orifice positioned at an oblique. The introduction of pressurized gas creates a vortex and vacuum attraction holding a wafer in close proximity to the chuck while the gas exiting from the chuck prevents contact between wafer and chuck. Small diameter chucks located in close proximity help the present invention avoid distortion when processing very thin workpieces. The gas exiting from the chuck of the present invention exits preferentially in a certain angular direction. Chucks are arranged on the wafer holder such that exiting gas is preferentially directed radially towards the periphery of the holder and that exiting gas is directed between adjacent chucks, not directly at another nearby chuck. Chucks on the periphery of the holder are positioned have the gas exiting therefrom towards the periphery of the holder and overlapping the gas flow from immediately adjacent chucks.

US Patent:

6448188, Sep 10, 2002

Filed:

Dec 14, 2001

Appl. No.:

10/020405

Inventors:

Oleg Siniaguine - San Jose CA
Alex Berger - Sunnyvale CA

Assignee:

Tru-Si Technologies, Inc. - Sunnyvale CA

International Classification:

H01L 2131

US Classification:

438758, 438782, 414935, 414936, 269 21

Abstract:

The present invention comprises a dynamic brake that applies restraining frictional force to a wafer in a wafer holder while the wafer holder is substantially at rest, but releases the restraining force as the processing carousel containing several wafer holders rotates about a central axis of the carousel. This dynamic brake preferably comprises a boot that passes through an opening in the wafer holder to rest on the surface of the wafer in an exclusion zone near the wafers edge. The exclusion zone is typically no more than about 3 mm in extent. The frictional force between the boot and wafer is sufficient to prevent unwanted motion of the wafer in the holder. As the wafer holder rotates about a central axis of the processing carousel, centrifugal forces applied to the brake arising from such rotation cause the boot to pivot upward, releasing the frictional force on the wafer.

US Patent:

6667242, Dec 23, 2003

Filed:

Jan 8, 2001

Appl. No.:

09/757242

Inventors:

Oleg Siniaguine - San Jose CA
Sergey Savastiouk - San Jose CA
Alex Berger - Palo Alto CA

Assignee:

Tru-Si Technologies, Inc. - Sunnyvale CA

International Classification:

C23F 102

US Classification:

438710, 15634535

Abstract:

The present invention comprises a brim surrounding a wafer or wafer-like object during plasma etching in a non-contact wafer holder, such brim facilitating uniform flow of the plasma discharge around the edge of the wafer during plasma etching. The brim of the present invention avoids plasma instability and non-uniform flow typical of conventional plasma etching near the edges of the wafer being etched. The brim of the present invention, by facilitating uniform and stable plasma flows, decreases non-uniform etching. One embodiment of the present invention permits the brim to move in the axial direction from a position substantially. This permits the etching process to be controlled for more uniform and precise wafer etching as lowering the brim tends to shadow the edge region of the wafer from the plasma, reducing etching in the edge region while not significantly affecting etching in the central regions of the wafer. Another embodiment of the wafer includes a barrier on the upper side of the brim directed upward from the brim at an oblique angle away from the wafer. This barrier contacts the upper surface of the brim so as to leave a protrusion or debris-collecting shelf on the upper interior portion of the brim.

US Patent:

62036610, Mar 20, 2001

Filed:

Dec 7, 1999

Appl. No.:

9/457042

Inventors:

Oleg Siniaguine - San Jose CA
Sergey Savastiouk - San Jose CA
Alex Berger - Palo Alto CA

Assignee:

TruSi Technologies, LLC - Sunnyvale CA

International Classification:

C23F 102

US Classification:

156345

Abstract:

The present invention comprises a brim surrounding a wafer or wafer-like object during plasma etching in a non-contact wafer holder, such brim facilitating uniform flow of the plasma discharge around the edge of the wafer during plasma etching. The brim of the present invention avoids plasma instability and non-uniform flow typical of conventional plasma etching near the edges of the wafer being etched. The brim of the present invention, by facilitating uniform and stable plasma flows, decreases non-uniform etching. One embodiment of the present invention permits the brim to move in the axial direction from a position substantially. This permits the etching process to be controlled for more uniform and precise wafer etching as lowering the brim tends to shadow the edge region of the wafer from the plasma, reducing etching in the edge region while not significantly affecting etching in the central regions of the wafer. Another embodiment of the wafer includes a barrier on the upper side of the brim directed upward from the brim at an oblique angle away from the wafer. This barrier contacts the upper surface of the brim so as to leave a protrusion or debris-collecting shelf on the upper interior portion of the brim.