Alex H Chau

US Patent:

7348866, Mar 25, 2008

Filed:

Nov 2, 2005

Appl. No.:

11/268413

Inventors:

Ming-Jong Shiau - Cerritos CA, US
Phu H. Tran - Huntington Beach CA, US
Alex T. Chau - Rancho Palos Verdes CA, US
Mark Kintis - Manhattan Beach CA, US
George W. Schreyer - Torrance CA, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H03H 7/01

US Classification:

333168, 333175, 333185

Abstract:

An LC filter structure and method for its fabrication, in which multiple shunt capacitors, multiple shunt inductors and multiple coupling inductors are printed on a metal layer formed on a thin dielectric substrate. The capacitors have first electrodes that are formed as spatially separated regions of the metal layer, and a common second electrode formed by a ground plane on the substrate. The shunt inductors are formed as spiral traces connected to the separated regions and to the ground plane, through conductive vias. The coupling inductors are similarly formed as spiral traces in the gaps between the separated regions, the ends of each coupling inductor being connected to respective adjacent regions of the metal layer.

US Patent:

7385459, Jun 10, 2008

Filed:

Sep 8, 2005

Appl. No.:

11/222254

Inventors:

Dahweih Duan - Torrance CA, US
Alex Chau - Rancho Palos Verdes CA, US
Janice Allen, legal representative - Rancho Palos Verdes CA, US
David Brunone - Rancho Palos Verdes CA, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H03H 7/38

US Classification:

333 33, 333 32, 333246

Abstract:

An apparatus in one example has: a substrate having a microstrip line; a capacitor at a predetermined location along the microstrip line, the capacitor producing a discontinuity; and a ground plane assembly on the substrate, the ground plane assembly having an opening that compensates for the discontinuity of the capacitor.

US Patent:

20070247231, Oct 25, 2007

Filed:

Apr 19, 2006

Appl. No.:

11/406777

Inventors:

Barry Allen - Rancho Palos Verdes CA, US
Janice Allen - Rancho Palos Verdes CA, US
David Brunone - Rancho Palos Verdes CA, US
Alex Chau - Rancho Palos Verdes CA, US

International Classification:

H03F 3/04

US Classification:

330296000

Abstract:

Systems are disclosed for providing a DC-bias network for a RF distributed amplifier. One embodiment may include a DC-bias network comprising a planar substrate having an input port configured to receive a DC input signal and provide a DC bias at an output port, a microstrip line mounted to the planar substrate and interconnecting the input port and the output port, and a plurality of RF resonators coupled to the microstrip line. Each of the plurality of RF resonators are configured to provide a substantially constant impedance for a respective portion of the frequency band of the RF signal