Alexander J Swinton
age ~68
from Hopewell Junction, NY
- Also known as:
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- John Swinton Alexander
- Swinton Alexander
- Phone and address:
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11 Rushmore Rd, East Fishkill, NY 12533
(845)2213208
Alexander Swinton Phones & Addresses
- 11 Rushmore Rd, Hopewell Junction, NY 12533 • (845)2213208
- East Fishkill, NY
- Mahopac, NY
- 11 Rushmore Rd, Hopewell Junction, NY 12533
Us Patents
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Multiple Device Test Layout
view source -
US Patent:6037795, Mar 14, 2000
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Filed:Sep 26, 1997
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Appl. No.:8/938871
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Inventors:Ronald G. Filippi - Wappingers Falls NY
James J. Poulin - Poughquag NY
Robert D. Raviart - Poughkeepsie NY
Kenneth P. Rodbell - Poughquag NY
Richard G. Smith - Poughkeepsie NY
Timothy D. Sullivan - Underhill VT
Alexander J. Swinton - Hopewell Junction NY -
Assignee:International Business Machines Corporation - Armonk NY
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International Classification:G01R 3128
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US Classification:324763
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Abstract:A test layout increases the sample size of electromigration experiments. Through pad sharing, the number of structures tested can be increased, allowing hundreds of identical structures to be tested in a single high temperature oven door.
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Sub-Quarter-Micron Copper Interconnections With Improved Electromigration Resistance And Reduced Defect Sensitivity
view source -
US Patent:60690682, May 30, 2000
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Filed:Oct 8, 1997
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Appl. No.:8/947277
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Inventors:Hazara S. Rathore - Stormville NY
Hormazdyar M. Dalal - Milton NY
Paul S. McLaughlin - Poughkeepsie NY
Du B. Nguyen - Danbury CT
Richard G. Smith - Poughkeepsie NY
Alexander J. Swinton - Hopewell Junction NY
Richard A. Wachnik - Brewster NY -
Assignee:International Business Machines Corporation - Armonk NY
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International Classification:B05D 506
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US Classification:438628
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Abstract:A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is deposited by chemical vapor deposition, or by physical vapor deposition in a layer less than about 800 angstroms.
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Sub-Quarter-Micron Copper Interconnections With Improved Electromigration Resistance And Reduced Defect Sensitivity
view source -
US Patent:62587102, Jul 10, 2001
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Filed:Dec 10, 1999
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Appl. No.:9/459167
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Inventors:Hazara S. Rathore - Stormville NY
Hormazdyar M. Dalal - Milton NY
Paul S. McLaughlin - Poughkeepsie NY
Du B. Nguyen - Danbury CT
Richard G. Smith - Poughkeepsie NY
Alexander J. Swinton - Hopewell Junction NY
Richard A. Wachnik - Brewster NY -
Assignee:International Business Machines Corporation - Armonk NY
-
International Classification:H01L 214763
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US Classification:438628
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Abstract:A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is deposited by chemical vapor deposition, or by physical vapor deposition in a layer less than about 800 angstroms.
Wikipedia
Clan Swint
view sourceIn 1640 Sir Alexander Swinton, the 22nd chief, became sheriff of Berwickshire. He died in 1652, leaving six sons and five daughters. ...
Wikipedia References
Alexander Swinton
About:
Died:
1700
Work:
Position:
Judge
Skills & Activities:
Preference:
Prisoner
Youtube
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