Alfred J Langon

US Patent:

7021945, Apr 4, 2006

Filed:

Apr 8, 2004

Appl. No.:

10/820296

Inventors:

Michael N. Perugini - Monroe CT, US
Gary D. Eastman - North Kingstown RI, US
Alfred J. Langon - Cranston RI, US
Raymond A. Prew - Foster RI, US
Erol D. Saydam - Foster RI, US

Assignee:

Advanced Interconnection Corporation - West Warwick RI

International Classification:

H01R 12/00

US Classification:

439 74, 439 92, 439 95

Abstract:

An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

US Patent:

7350290, Apr 1, 2008

Filed:

Nov 12, 2004

Appl. No.:

10/987246

Inventors:

Glenn Goodman - Cumberland RI, US
Gary D. Eastman - North Kingstown RI, US
Alfred J. Langon - Cranston RI, US
Erol D. Saydam - Foster RI, US

Assignee:

Advanced Interconnections Corporation - West Warwick RI

International Classification:

H05K 13/04

US Classification:

29764, 29741, 439 73, 439331

Abstract:

A compression device has a frame sized to accept an integrated circuit package and a pressor. The frame includes a surface defining an opening with an axis and at least one ramp extending from the surface. The ramp or ramps have upper and lower flat portions, substantially parallel with a plane perpendicular to the axis, and a sloped portion at an angle relative to the plane, the sloped portion connecting the upper and lower flat portions. The pressor is configured to engage the ramp and rotate in response to applied force. When the pressor is engaged with the sloped portion(s) of the ramp(s), this rotation causes movement of the pressor along the axis. However, when engagement between the ramps and the pressor is in the flat portions of the ramp, continued movement of the pressor along the axis is limited in spite of any continued rotation.

US Patent:

8109770, Feb 7, 2012

Filed:

Apr 4, 2006

Appl. No.:

11/397334

Inventors:

Michael N. Perugini - Monroe CT, US
Gary D. Eastman - North Kingstown RI, US
Alfred J. Langon - Cranston RI, US
Raymond A. Prew - Foster RI, US
Erol D. Saydam - Foster RI, US

Assignee:

Advanced Interconnections Corp. - West Warwick RI

International Classification:

H01R 12/00

US Classification:

439 74, 43960712

Abstract:

An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals. The intercoupling component may include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

US Patent:

20030236031, Dec 25, 2003

Filed:

Jun 24, 2002

Appl. No.:

10/178957

Inventors:

Michael Perugini - Monroe CT, US
Gary Eastman - North Kingstown RI, US
Alfred Langon - Cranston RI, US
Raymond Prew - Foster RI, US
Erol Saydam - Foster RI, US

International Classification:

H01R013/648

US Classification:

439/607000

Abstract:

An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

US Patent:

20040166704, Aug 26, 2004

Filed:

Feb 25, 2004

Appl. No.:

10/786248

Inventors:

Michael Perugini - Monroe CT, US
Gary Eastman - North Kingstown RI, US
Alfred Langon - Cranston RI, US
Raymond Prew - Foster RI, US
Erol Saydam - Foster RI, US

Assignee:

Advanced Interconnections Corporation, a Rhode Island corporation

International Classification:

H01R012/00

US Classification:

439/074000

Abstract:

An intercoupling component for receiving an array of contacts includes a non-conductive substrate having a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of contacts. Contacts are disposed within the holes and a cavities, which may be open to air or filled with some other dielectric material, are disposed in the substrate between adjacent contacts.

US Patent:

20070111578, May 17, 2007

Filed:

Nov 15, 2005

Appl. No.:

11/273763

Inventors:

Alfred Langon - Cranston RI, US
Richard Alviti - Cranston RI, US

International Classification:

H01R 13/62

US Classification:

439300000

Abstract:

A method of manufacturing a mold and a mold for forming an intercoupling component of the type used to couple an array of electrical connection regions disposed on a first substrate to an array of electrical connection regions disposed on a second substrate. A plurality of plates are provided, each plate including an array of holes arranged in a pattern corresponding to the array of electrical connection regions of the first substrate. A base is formed by stacking the plates with the holes substantially aligned. Pins are inserted into apertures formed in the base by the aligned holes. A housing is assembled with the base, pins, at least one sidewall, and a cover, the housing including a substantially enclosed cavity, the housing also including at least one opening to enable injection of molten material into the cavity.