Alfredo M Mendoza

US Patent:

7208841, Apr 24, 2007

Filed:

Jul 30, 2004

Appl. No.:

10/909124

Inventors:

James Jen-Ho Wang - Phoenix AZ, US
Jin-Wook Jang - Chandler AZ, US
Alfredo Mendoza - Mesa AZ, US
Rajashi Runton - Chandler AZ, US
Russell Shumway - Tempe AZ, US

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 23/48
H01L 23/52
H01L 29/40
H05K 1/00

US Classification:

257780, 257781, 257782, 257784, 257751, 439 81

Abstract:

A semiconductor device () is provided. The device () comprises a die () having a contact pad () thereon, a redistribution conductor () having a base portion () which is in electrical communication with the contact pad () and a laterally extending portion (), a bumped contact () which is in electrical communication with the redistribution conductor (), and a passivation layer () disposed between the laterally extending portion () of the redistribution conductor () and the die (). Preferably, the redistribution conductor () is convoluted and is adapted to peel or delaminate from the passivation layer () under sufficient stress so that it can shift relative to the passivation layer () and base portion () to relieve mechanical stress between substrate () and the die (). Bump and coiled redistribution conductor () accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.

US Patent:

6790759, Sep 14, 2004

Filed:

Jul 31, 2003

Appl. No.:

10/631102

Inventors:

James Jen-Ho Wang - Phoenix AZ
Jin-Wook Jang - Chandler AZ
Alfredo Mendoza - Mesa AZ
Rajashi Runton - Chandler AZ
Russell Shumway - Tempe AZ

Assignee:

Freescale Semiconductor, Inc. - Schaumburg IL

International Classification:

H01L 2144

US Classification:

438612, 438613, 438622

Abstract:

A semiconductor device ( ) is provided. The device ( ) comprises a die ( ) having a contact pad ( ) thereon, a redistribution conductor ( ) having a base portion ( ) which is in electrical communication with the contact pad ( ) and a laterally extending portion ( ), a bumped contact ( ) which is in electrical communication with the redistribution conductor ( ), and a passivation layer ( ) disposed between the laterally extending portion ( ) of the redistribution conductor ( ) and the die ( ). Preferably, the redistribution conductor ( ) is convoluted and is adapted to peel or delaminate from the passivation layer ( ) under sufficient stress so that it can shift relative to the passivation layer ( ) and base portion ( ) to relieve mechanical stress between substrate ( ) and the die ( ). Bump and coiled redistribution conductor ( ) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.