Allan R Berman

US Patent:

6837253, Jan 4, 2005

Filed:

Apr 22, 2002

Appl. No.:

10/127161

Inventors:

Allan Berman - Sunnyvale CA, US

Assignee:

Imtec Acculine, Inc. - Sunnyvale CA

International Classification:

B08B 304

US Classification:

134117, 134186, 134136, 134902

Abstract:

A liquid process tank that provides a quick dump feature includes a fixed bottom wall assembly and moveable tank side walls that contain liquid and also act as a quick dump valve for the liquid. The bottom wall assembly includes an acoustic transducer secured thereto. The tank side walls are secured to a plurality of linear actuators adapted for vertical movement. A seal is secured to the lower edge of the side wall assembly to impinge on a land surface that extends about the perimeter of the bottom wall assembly. The linear actuators are retracted to draw join the bottom and side wall assemblies to retain liquid, or activated in unison to drive the tank walls upwardly from the fixed bottom wall assembly, creating a bottom opening in the tank that quickly discharges all the liquid from the tank.

US Patent:

50565524, Oct 15, 1991

Filed:

Feb 4, 1991

Appl. No.:

7/650193

Inventors:

Allan Berman - Sunnyvale CA

Assignee:

Imtec Products, Inc. - Sunnyvale CA

International Classification:

F16K 4900

US Classification:

137334

Abstract:

A chemical bath for immersing articles such as integrated circuit wafers in a hot flow of etchant or other liquid includes a liquid receptacle with a first compartment for receiving the articles and a second compartment which acts as sump and further includes a trough which channels overflow from the first compartment into the sump. A pump recirculates liquid from the sump back to the first compartment. The receptacle is supported by a casing in which the lower region of the receptacle is situated. The casing in which the lower region of the receptacle is situated. The casing is sealed by a flange on the receptacle which overlays a rim member on the casing and by sealing material situated between the rim member and the underside of the flange. The flange is located below the trough in vertically spaced apart relationship with the trough. This inhibits direct heat transfer from the trough to the seal and thereby enhances seal durability.

US Patent:

47499885, Jun 7, 1988

Filed:

Nov 20, 1986

Appl. No.:

6/932573

Inventors:

Allan Berman - Sunnyvale CA
Henry R. Miranda - Palo Alto CA

Assignee:

Imtec Products, Inc. - Sunnyvale CA

International Classification:

G08B 2100

US Classification:

340618

Abstract:

A non-invasive liquid level sensor assembly includes a pair of conductive band electrodes oriented in parallel, narrowly spaced relationship and disposed so that the gap between the electrodes corresponds to the liquid surface level to be detected. The electrodes are secured to the outer surface of a liquid container, and connected to a capacitive detector device which measures the change in electrical capacity between the conductors as the liquid rises or falls past the level of the gap between the electrodes. A shield electrode is also provided, disposed outwardly of and concavely about the sensing electrodes to eliminate sensitivity to masses outside of the container. In one embodiment the electrodes are secured with a sealed, arcuate housing which is adapted to be permanently or temporarily secured to the exterior of a liquid container by adhesive, removable straps, or the like. In another embodiment adapted for double-walled containers, the sensing electrodes are secured to the outer surface of the inner container, and the shield electrode is secured to the confronting interior surface of the outer container.

US Patent:

50545191, Oct 8, 1991

Filed:

Dec 26, 1990

Appl. No.:

7/633690

Inventors:

Allan Berman - Sunnyvale CA

Assignee:

Imtec Products, Inc. - Sunnyvale CA

International Classification:

E03B 707

US Classification:

137563

Abstract:

A chemical bath in which batches of integrated circuit wafers or other articles are immersed in hot liquid chemical during manufacture has a processing vessel, an adjacent sump vessel and a trough which carries overflow from the processing vessel to the sump vessel. A pump continuously recirculates liquid from the sump vessel to the processing vessel through a filter. A continuous inflow of liquid is received from a liquid chemical source and an intermittent outflow occurs through an outlet at an upper region of the sump vessel. The liquid chemical source may, for example, supply make-up fluid or be a reprocessor that repurifies the outflow from the sump vessel. The storage capacity of the sump vessel below the outlet is greater than that needed to contain the volume of liquid that is displaced in the processing vessel by the batch of wafers. This avoids pump starvation when liquid level is lowered in the processing vessel by removal of a batch of wafers and also assures that outflow matches inflow from the liquid chemical source over a period of time without requiring flow sensing devices, dynamic valving or other complications.

US Patent:

50147374, May 14, 1991

Filed:

Nov 13, 1989

Appl. No.:

7/434709

Inventors:

Allan Berman - Sunnyvale CA

International Classification:

E03B 707

US Classification:

137334

Abstract:

A recirculating chemical bath arrangement includes a quartz process tank, and a sump chamber disposed directly adjacent to the process tank. A trough extends about the top portion of the outer walls of the process tank, the trough being inclined to cause gravital flow toward the sump chamber. The sump chamber includes a fitting in the bottom thereof which directs liquid from the sump into a pump/filter circuit, the output of which is fed into the bottom of the process tank. The liquid is thus caused to overflow the process tank and spill into the trough, and flow into the adjacent sump chamber. A plurality of heater units are secured to the exterior surface of the process tank to heat the liquid therein to the proper process temperature. The sump chamber is unheated, so that the liquid entering the pump/filter is at the coolest temperature of the liquid flow cycle. The process tank and sump chamber may be formed integrally of molded and welded quartz plates, and disposed within an outer case that contains thermal insulation.