Alvin Schneider

US Patent:

40861791, Apr 25, 1978

Filed:

Dec 10, 1976

Appl. No.:

5/749274

Inventors:

Alvin F. Schneider - Edison NJ

Assignee:

Alpha Metals, Inc. - Jersey City NJ

International Classification:

C23G 502
C11D 750
C11D 730

US Classification:

252171

Abstract:

Improved cleaning compositions for the removal of various forms of contamination from printed circuit boards and other related electronic equipment in vapor cleaning processes are disclosed, including major amounts of 1,1,1-trichloroethane and an amount of normal propanol less than that in the true azeotropic mixture of these components, generally from about 1. 0 to less than 4. 75 weight percent of the normal propanol. In addition, vapor cleaning processes utilizing such solvent compositions are also disclosed, and in a preferred embodiment, the composition includes about 96. 0 weight percent of the 1,1,1-trichloroethane and about 4. 0 weight percent of the normal propanol.

US Patent:

55713408, Nov 5, 1996

Filed:

Sep 9, 1994

Appl. No.:

8/303668

Inventors:

Alvin F. Schneider - Warren NJ
David B. Blumel - New York NY
Jack Brous - Livingston NJ

Assignee:

Fry's Metals, Inc. - Providence RI

International Classification:

B23K 3534

US Classification:

148 23

Abstract:

A rosin-free, low VOC, no-clean soldering flux consists essentially of one or more halide-free carboxylic acid activators in an aggregate amount not exceeding about 8% by weight of the flux; one or more alkyl amines capable of forming amine salt of the one or more activators and in an aggregate amount not exceeding about 10% by weight of the flux; and water, with or without a surfactant. The flux is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary.

US Patent:

52977218, Mar 29, 1994

Filed:

Nov 19, 1992

Appl. No.:

7/976931

Inventors:

Alvin F. Schneider - Edison NJ
David B. Blumel - New York NY
John V. Tomczak - Dolton IL

Assignee:

Fry's Metals, Inc. - Providence RI

International Classification:

B23K 35363

US Classification:

2281801

Abstract:

A no-clean soldering flux consists essentially of one or more halide-free, water soluble activators in an aggregate amount not exceeding about 5% by weight of the flux, a water soluble fluorinated surfactant in an amount not exceeding about 1% by weight of the flux, and water. The flux is substantially VOC-free and is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary. The absence of significant amounts of VOC's and the elimination of post-soldering cleaning result in substantial environmental and production-related benefits.

Address:

32 Gln Dr E, Boynton Beach, FL 33436

VIN:

3LNHM26T88R640386

Make:

LINCOLN

Model:

MKZ

Year:

2008