Andrew Harvey Barr

US Patent:

6559733, May 6, 2003

Filed:

Aug 6, 2001

Appl. No.:

09/923735

Inventors:

Thane M. Larson - Roseville CA
Andrew H. Barr - Roseville CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

H01P 126

US Classification:

333 22R, 333 32, 333 12, 333 81 A, 333177, 361502, 361762, 361760, 361700, 361772, 361763

Abstract:

The present invention, in various embodiments, provides techniques for reducing effects of electrical impedance. In one embodiment, the impedance is in the form of inductance and arises from vias in a termination PCB and from resistors used on the PCB. In one embodiment, a power plane is placed near the resistors. Additional power and ground planes are created in parallel among themselves and perpendicular to the vias, which cause capacitance to be formed between each pair of the ground and power planes, the ground planes and the vias, and the power planes and the vias. In one aspect, the power plane near the resistors and the formed capacitance allow the high-frequency returned currents to flow through a smaller loop and thus be affected by a smaller inductance. Additionally, the created capacitance reduces both the total impedance of the vias and the resistors and any impedance that result from power-ground discontinuity.

US Patent:

6676417, Jan 13, 2004

Filed:

Dec 3, 2002

Appl. No.:

10/308533

Inventors:

Jeremy Ian Wilson - Rocklin CA
Andrew Harvey Barr - Roseville CA
Stephan Karl Barsun - Auburn CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01R 1200

US Classification:

439 67, 439443, 439364, 439362

Abstract:

Systems for electrically interconnecting components are provided. One such system comprises: a flex cable having a first end and a second end; a first connector attached to and electrically communicating with the first end of the flex cable; a second connector attached to and electrically communicating with the second end of the flex cable; and a first retention member extending outwardly from the flex cable.

US Patent:

6680853, Jan 20, 2004

Filed:

Jan 27, 2003

Appl. No.:

10/351950

Inventors:

Robert William Dobbs - Granite Bay CA
James Kristian Koch - Rocklin CA
Andrew Harvey Barr - Roseville CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 702

US Classification:

361810, 361818, 361717

Abstract:

Systems for mounting components to circuit assemblies are provided. One such system comprises a circuit assembly having a front, a back, a length and a width. A support structure is attached to one of the front and the back of the circuit assembly, with the support structure being sized and shaped to span at least one of the length and the width of the circuit assembly. A first component is attached to the support structure such that at least a portion of the support structure is located between the first component and the circuit assembly, with the first component electrically communicating with the circuit assembly. Methods and other systems also are provided.

US Patent:

6767220, Jul 27, 2004

Filed:

Sep 25, 2003

Appl. No.:

10/671647

Inventors:

Jeremy Ian Wilson - Rocklin CA
Andrew Harvey Barr - Roseville CA
Stephan Karl Barsun - Auburn CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01R 1200

US Classification:

439 67, 439493, 439362, 439364

Abstract:

System for electrically interconnecting components are provided. One such system comprises: a flex cable having a first end and a second end; a first connector attached to a electrically communicating with the first end of the flex cable; a second connector attached to and electrically communicating with the second end of the flex cable; and a first retention member extending outwardly from the flex cable.

US Patent:

6791843, Sep 14, 2004

Filed:

Jun 11, 2003

Appl. No.:

10/459231

Inventors:

Robert W. Dobbs - Granite Bay CA
Stephan K. Barsun - Davis CA
Andrew H. Barr - Roseville CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 700

US Classification:

361758, 361754, 361759, 361742, 361747, 361801, 361740, 361770

Abstract:

An electronic system includes a first system component having a first connector and a second system component having a second connector. One of the first system component having the second system component pivots between a first position in which the first connector and the second connector are disconnected and a second position in which the first connector and the second connector are connected.

US Patent:

6812719, Nov 2, 2004

Filed:

May 28, 2003

Appl. No.:

10/447798

Inventors:

Andrew Harvey Barr - Roseville CA
Robert William Dobbs - Granite Bay CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

G01R 3102

US Classification:

324754, 324758

Abstract:

A signal probe includes a conductive probe tip for contacting a signal node of an electronic device, and a mount to hold the tip in contact with the node. With such a probe, a technician no longer has to hold the probe to maintain contact with a signal node, such as a lead of a component.

US Patent:

6843660, Jan 18, 2005

Filed:

Nov 21, 2003

Appl. No.:

10/719937

Inventors:

Andrew Harvey Barr - Roseville CA, US
Jeremy Ian Wilson - Roseville CA, US
Irving McKenzie Birmingham - Rocklin CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01R 1200

US Classification:

439 67

Abstract:

An embodiment of a cable system includes a cable that has a conductor, a power layer and dielectric material. The conductor is operative to carry a signal, the dielectric material is located at least partially between the conductor and the power layer, and the power layer is operative as ground. The power layer is formed of a conductive material and includes a first region and an adjacent second region. The first region includes a greater amount of the conductive material than the second region so that the power layer is less resistant to bending along the second region than along the first region. Methods and other systems are also provided.

US Patent:

6856518, Feb 15, 2005

Filed:

Jul 14, 2003

Appl. No.:

10/619026

Inventors:

Robert William Dobbs - Granite Bay CA, US
Andrew Harvey Barr - Roseville CA, US
Stephan Karl Barsun - Davis CA, US

Assignee:

Hewlett Packard Development Company, L.P. - Houston TX

International Classification:

H05K007/14
H05K007/18

US Classification:

361801, 361684, 361685, 361740, 361736

Abstract:

An assembly for supporting a short printed circuit card includes a card slot separator disposed in a card bay of a computer system and at least one card support block. The at least one card support block couples to the card slot separator and can be selectively positioned along the card slot separator for reception of an unsupported edge of the short printed circuit card.