Andrew D Hunt

US Patent:

6368665, Apr 9, 2002

Filed:

Apr 29, 1998

Appl. No.:

09/067975

Inventors:

Andrew T. Hunt - Atlanta GA
Subramaniam Shanmugham - Doraville GA
William D. Danielson - Decatur GA
Henry A. Luten - Doraville GA
Tzyy Jiuan Hwang - Alpharetta GA
Girish Deshpande - Atlanta GA

Assignee:

MicroCoating Technologies, Inc. - Chamblee GA

International Classification:

C23C 1600

US Classification:

427250, 427255, 4272551, 4272556, 427561, 427569, 427576, 427585

Abstract:

An improved chemical vapor deposition apparatus and procedure is disclosed. The technique provides improved shielding of the reaction and deposition zones involved in providing CVD coatings, whereby coatings can be produced, at atmospheric pressure, of materials which are sensitive to components in the atmosphere on substrates which are sensitive to high temperatures and which are too large, or inconvenient, to process in vacuum or similar chambers. The improved technique can be used with various energy sources and is particularly compatible with Combustion Chemical Vapor Deposition (CCVD) techniques.

US Patent:

6372364, Apr 16, 2002

Filed:

Aug 18, 1999

Appl. No.:

09/376625

Inventors:

Andrew T. Hunt - Atlanta GA

Assignee:

MicroCoating Technologies, Inc. - Atlanta GA

International Classification:

B32B 300

US Classification:

428607, 118301, 118406, 156344, 427 99, 427124, 42725525, 427256, 428624, 428628, 428629, 428632, 428636, 428637, 428640, 428646, 428647, 428648, 428651, 428652, 428656, 428658, 428665, 428669, 428670, 428671, 428672, 428673, 428674, 428675, 428680, 428687, 428901, 428924, 428926, 428938

Abstract:

A thin film product having a nanostructured surface, a laminate product including the thin film and a temporary substrate opposite the nanostructured surface, a laminate product including the thin film and a final substrate attached to the nanostructured surface and a method of producing the thin film products. The thin film is particularly useful in the electronics industry for the production of integrated circuits, printed circuit boards and EMF shielding. The nanostructured surface includes surface features that are mostly smaller than one micron, while the dense portion of the thin film is between 10-1000 nm. The thin film is produced by coating a temporary substrate (such as aluminum foil) with a coating material (such as copper) using any process. One such method is concentrated heat deposition or a combustion, chemical vapor deposition process. The resulting thin film provides a high level of adhesion to a final substrate, by embedding the nanostructures with the material of the final substrate (such as an epoxy resin).

US Patent:

6390076, May 21, 2002

Filed:

May 8, 2001

Appl. No.:

09/851349

Inventors:

Andrew T. Hunt - Chamblee GA

Assignee:

MicroCoating Technologies, Inc. - Atlanta GA

International Classification:

F02G 500

US Classification:

123549, 123557, 431208

Abstract:

A method for causing a very fine atomization or vaporization of a liquid or liquid-like fluid, where the resulting atomized or vaporized solution is entered into engine, instrument or area for the fluid to be in mixed. The ability of the near supercritical atomizer to produce very fine droplets of a wide range of liquids without any aspirant is very important for number of industrial applications. Especially when the drop size can be so finely controlled. Industries needing such fine atomization include applications such as combustion, engines, scientific equipment, chemical processing, waste disposal control, cleaning, etching, insect control, surface modification, humidification and vaporization. It is important in these applications not to cause a decomposition of the material being atomized. Staying below the supercritical point normally enables no decomposition and/or no precipitation of components within the liquid or fluid in most applications, but a very fine atomization is obtained without the need of any aspirant.

US Patent:

6396387, May 28, 2002

Filed:

Apr 13, 1999

Appl. No.:

09/291259

Inventors:

Andrew T. Hunt - Atlanta GA
Wen-Yi Lin - Doraville GA
Shara S. Shoup - Woodstock GA

Assignee:

MicroCoating Technologies, Inc. - Chamblee GA

International Classification:

H01C 1012

US Classification:

338308, 338309, 338254, 338307

Abstract:

In thin layer resistors comprising a patch of a layer of resistive material on an insulating substrate and means at spaced apart locations on the patch, the resistive material is formed of 95 to 99. 5 wt % of a zero valence metal and between 5 and 0. 5 wt % of a dielectric material.

US Patent:

6403245, Jun 11, 2002

Filed:

May 21, 1999

Appl. No.:

09/316855

Inventors:

Andrew T. Hunt - Atlanta GA

Assignee:

MicroCoating Technologies, Inc. - Atlanta GA

International Classification:

H01M 810

US Classification:

429 33, 429 30, 429 42, 429 44, 502101, 427115

Abstract:

The materials and processes for forming fuel cell electrodes can include substrates of codeposited materials including an electrically conductive material, such as graphite, a polymer film, such as a proton-exchange membrane, and a catalytic material, such as platinum. The material may be applied to a polymer film by combustion chemical vapor deposition (CCVD) to produce a layered membrane, or the polymer may be deposited simultaneously with the catalytic coating to produce a membrane wherein the layers are intermingled. Proton exchange membranes prepared by this method are useful in the manufacture of fuel cells.

US Patent:

6416870, Jul 9, 2002

Filed:

Jul 28, 2000

Appl. No.:

09/627708

Inventors:

Andrew Tye Hunt - Atlanta GA
Tzyy Jiuan Hwang - Alpharetta GA
Michelle R. Hendrick - Winder GA
Hong Shao - Atlanta GA
Joseph R. Thomas - Atlanta GA

Assignee:

MicroCoating Technologies, Inc. - Atlanta GA

International Classification:

B32B 1504

US Classification:

428450, 428704, 428701, 428702, 428472, 428469, 428220, 428336, 427327, 427375

Abstract:

A corrosion-resistant coating for a substrate is described. The corrosion-resistant coating comprises a first distinct layer of a first composition disposed over the substrate, wherein the first distinct layer has a thickness that is not greater than about 10 microns, and a second distinct layer of a second composition disposed over the first distinct layer, wherein the second distinct layer has a thickness that is not greater than about 10 microns and either the first distinct layer or the second distinct layer is corrosion-resistant. Preferably, the thickness of each distinct layer is less than about 1 or 2 microns, more preferably, less than about 0. 4 microns. The coating may comprise additional layers. Corrosion-resistant articles, methods of protecting an articles, and methods of depositing corrosion-resistant coatings are also described.

US Patent:

6433993, Aug 13, 2002

Filed:

Mar 31, 1999

Appl. No.:

09/283100

Inventors:

Andrew T. Hunt - Atlanta GA
Wen-Yi Lin - Doraville GA
Tzyy Jiuan Hwang - Alpharetta GA
Michelle Hendrick - Winder GA
Helmut G. Hornis - Hudson OH

Assignee:

MicroCoating Technologies, Inc. - Chamblee GA

International Classification:

H01G 4005

US Classification:

361303, 3613063, 3613014, 361311

Abstract:

Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0. 03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.

US Patent:

6500350, Dec 31, 2002

Filed:

Feb 8, 2001

Appl. No.:

09/779990

Inventors:

Andrew T. Hunt - Atlanta GA
Wen-Yi Lin - Doraville GA
Shara S. Shoup - Woodstock GA
Richard W. Carpenter - Johnson City NY
Stephen E. Bottomley - Brea CA
Tzyy Jiuan Hwang - Alpharetta GA
Michelle Hendrick - Winder GA

Assignee:

Morton International, Inc. - Chicago IL

International Classification:

H01C 112

US Classification:

216 16, 216 20

Abstract:

A method is provided for forming a patterned layer of resistive material in electrical contact with a layer of electrically conducting material. A three-layer structure is formed which comprises a metal conductive layer, an intermediate layer formed of material which is degradable by a chemical etchant, and a layer of resistive material of sufficient porosity such that the chemical etchant for said intermediate layer may seep through the resistive material and chemically degrade said intermediate layer so that the resistive material may be ablated from said conductive layer wherever the intermediate layer is chemically degraded. A patterned photoresist layer is formed on the resistive material layer. The resistive material layer is exposed to the chemical etchant for said intermediate layer so that the etchant seeps through the porous resistive material layer and degrades the intermediate layer. Then, portions of the resistive material layer are ablated away wherever the intermediate layer has been degraded.