Andrew A Miner

US Patent:

6708501, Mar 23, 2004

Filed:

Dec 6, 2002

Appl. No.:

10/313696

Inventors:

Uttam Ghoshal - Austin TX
Andrew Carl Miner - Austin TX

Assignee:

Nanocoolers, Inc. - Austin TX

International Classification:

F25B 2102

US Classification:

62 37, 622592, 16510419

Abstract:

A system to provide effective removal of heat from a high power density device. The system has a heat spreader and a heat sink structure. The heat spreader is divided into one or more chambers. Electromagnetic pumps are placed inside each chamber in a configuration that facilitates easy circulation of liquid metal inside the chamber. The liquid metal preferably is an alloy of gallium and indium that has high electrical conductivity and high thermal conductivity. The liquid metal carries heat from a localized area (over the high power density device) and distributes it over the entire spreader. This results in a uniform distribution of heat on the base of the heat sink structure and hence effective removal of heat by the heat sink structure.

US Patent:

7131286, Nov 7, 2006

Filed:

Jan 30, 2004

Appl. No.:

10/768767

Inventors:

Uttam Ghoshal - Austin TX, US
Andrew Carl Miner - Austin TX, US

Assignee:

NanoCoolers, Inc. - Austin TX

International Classification:

F28D 15/00

US Classification:

622592, 62 37

Abstract:

Apparatus to provide effective removal of heat from a high power density device. The apparatus has a heat spreader and a heat sink structure. The heat spreader is divided into one or more chambers. Electromagnetic pumps are placed inside each chamber in a configuration that facilitates easy circulation of liquid metal inside the chamber. The liquid metal preferably is an alloy of gallium and indium that has high electrical conductivity and high thermal conductivity. The liquid metal carries heat from a localized area (over the high power density device) and distributes it over the entire spreader. This results in a uniform distribution of heat on the base of the heat sink structure and hence effective removal of heat by the heat sink structure.

US Patent:

8394679, Mar 12, 2013

Filed:

Sep 1, 2010

Appl. No.:

12/874212

Inventors:

Mark F Eaton - Austin TX, US
Curtis Nathan Potter - Austin TX, US
Andrew Miner - San Francisco CA, US

Assignee:

Stellarray, Inc. - Austin TX

International Classification:

H01L 21/00

US Classification:

438118, 438121, 438125, 257E2318, 257E21499, 257E215

Abstract:

A structure and method for cold weld compression bonding using a metallic nano-structured gasket is provided. This structure and method allows a hermetic package to be formed at lower pressures and temperatures than are possible using bulk or conventional thin-film gasket materials.

US Patent:

20040234379, Nov 25, 2004

Filed:

May 22, 2003

Appl. No.:

10/443190

Inventors:

Andrew Miner - Austin TX, US
Uttam Ghoshal - Austin TX, US
Key Kolle - Luling TX, US

Assignee:

NANOCOOLERS, INC. - Austin TX

International Classification:

H02K044/08

US Classification:

417/050000

Abstract:

The present invention provides configurations of direct current magnetohydrodynamic (DC MHD) pumps for enhanced performance in pumping of conducting fluids. The pumping is achieved by a force developed by the interaction of magnetic flux and electric current. The force acting on the conducting fluid can be increased by increasing the magnetic flux density or the path length of charge carriers. The path length of charge carriers is increased by using a centrifugal configuration of the pump. The magnetic flux density is increased by using unique magnet configurations. A two-magnet configuration, a four-magnet configuration or a Halbach array configuration is used to enhance the magnetic flux density in the fluid cavity.

US Patent:

20040234392, Nov 25, 2004

Filed:

May 22, 2003

Appl. No.:

10/443186

Inventors:

Uttam Ghoshal - Austin TX, US
Andrew Miner - Austin TX, US
Key Kolle - Luling TX, US

Assignee:

NANOCOOLERS INC.

International Classification:

F04B035/04

US Classification:

417/410100

Abstract:

The present invention provides an improved fluid pump that combines a liquid metal MHD pump with a plurality of fluid flow valves. The pump comprises a suction and pumping assembly, the suction and pumping assembly in turn comprising a first vertical chamber and a second vertical chamber connected using an intermediate horizontal chamber, a liquid metal partially filling the suction and pumping assembly, and an AC-powered reciprocating MHD pump. The AC-powered reciprocating MHD pump drives the liquid metal in an oscillatory manner, causing the suction and pumping of a working fluid. The pump further comprises at least one inlet conduit connected to the suction and pumping assembly for enabling the suction of a working fluid, at least one outlet conduit connected to the suction and pumping assembly for enabling the pumping of the working fluid, and a plurality of valves in the inlet and outlet conduits to regulate the flow of the working fluid.

US Patent:

20050150539, Jul 14, 2005

Filed:

Dec 23, 2004

Appl. No.:

11/020531

Inventors:

Uttam Ghoshal - Austin TX, US
Srikanth Samavedam - Austin TX, US
Tat Ngai - Austin TX, US
Andrew Miner - Austin TX, US

International Classification:

H01L035/12
H01L035/30
H01L037/00
H01L035/34

US Classification:

136205000, 136201000

Abstract:

A vertical, monolithic, thin-film thermoelectric device is described. Thermoelectric elements of opposing conductivity types may be coupled electrically in series and thermally in parallel by associated electrodes on a single substrate, reducing the need for mechanisms to attach multiple substrates or components. Phonon transport may be separated from electron transport in a thermoelectric element. A thermoelectric element may have a thickness less than an associated thermalization length. An insulating film between an electrode having a first temperature and an electrode having a second temperature may be a low-thermal conductivity material, a low-k, or ultra-low-k dielectric. Phonon thermal conductivity between a thermoelectric element and an electrode may be reduced without a significant reduction in electron thermal conductivity, as compared to other thermoelectric devices. A phonon conduction impeding material may be included in regions coupling an electrode to an associated thermoelectric element (e.g., a liquid metal).

US Patent:

20050160752, Jul 28, 2005

Filed:

Jan 23, 2004

Appl. No.:

10/763303

Inventors:

Uttam Ghoshal - Austin TX, US
Andrew Miner - Austin TX, US

Assignee:

NANOCOOLERS, INC. - Austin TX

International Classification:

F28D015/00
F25D017/02
F25D023/12

US Classification:

062259200, 165104280, 062118000

Abstract:

A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high power density device and rejecting the heat at a heat sink located at a distance. The system may make use of a thermoelectric generator to power the electromagnetic pumps by utilizing the temperature difference between the inlet and outlet pipes of the heat sink. The system also provides networks of primary and secondary closed conduits having series and parallel arrangements of electromagnetic pumps for dissipating heat from multiple devices at a remotely located heat sink.

US Patent:

20050189089, Sep 1, 2005

Filed:

Feb 27, 2004

Appl. No.:

10/789205

Inventors:

Andrew Miner - Austin TX, US

Assignee:

NANOCOOLERS INC. - AUSTIN TX

International Classification:

H05K007/20

US Classification:

165080400, 361699000

Abstract:

A fluidic apparatus and method for cooling a non-uniformly heated heat source such as an integrated circuit. The apparatus preferentially cools a non-uniformly heated integrated circuit. A coolant is introduced into a high-power region of the integrated circuit through an inlet. The coolant absorbs heat from this region and cools it. Thereafter, the coolant is transferred to the low-power region of the integrated circuit. After the coolant absorbs heat from the low-power region, it is removed from an outlet, which is connected to the low-power region of the integrated circuit.