Andrew Proctor

US Patent:

7772090, Aug 10, 2010

Filed:

Sep 30, 2003

Appl. No.:

10/674960

Inventors:

Robert Starkston - Phoenix AZ, US
Andrew Proctor - Chandler AZ, US
Steve Terry - Glendale AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 21/301

US Classification:

438462, 438463

Abstract:

A method for singulating dies from a wafer includes laser scribing a continuous line on each side of the die, and laser ablating an area adjacent the laser scribed continuous line on each side of the die. The laser ablations in the area adjacent the laser scribed continuous line on each side of the die being spaced from one another. The method also includes sawing the laser abated area adjacent the continuous line. A method for singulating dies from a wafer includes laser scribing a first continuous line, laser scribing a second continuous line spaced apart from the first continuous line, and laser scribing a third continuous line. The third continuous line positioned between the first continuous line and the second continuous line. The third continuous line overlaps the second continuous line and the third continuous line.

US Patent:

8364304, Jan 29, 2013

Filed:

Jul 14, 2010

Appl. No.:

12/836448

Inventors:

Robert Starkston - Phoenix AZ, US
Andrew Proctor - Chandler AZ, US
Steve Terry - Glendale AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 21/301
H01L 21/304

US Classification:

700166, 264400, 2191216, 483463

Abstract:

A method for singulating dies from a wafer includes laser scribing a continuous line on each side of the die, and laser ablating an area adjacent the laser scribed continuous line on each side of the die. The laser ablations in the area adjacent the laser scribed continuous line on each side of the die being spaced from one another. The method also includes sawing the laser abated area adjacent the continuous line. A method for singulating dies from a wafer includes laser scribing a first continuous line, laser scribing a second continuous line spaced apart from the first continuous line, and laser scribing a third continuous line. The third continuous line positioned between the first continuous line and the second continuous line. The third continuous line overlaps the second continuous line and the third continuous line.

US Patent:

20190067213, Feb 28, 2019

Filed:

Nov 13, 2015

Appl. No.:

15/767306

Inventors:

- SANTA CLARA CA, US
Mihir A. Oka - Chandler AZ, US
Andrew Proctor - Chandler AZ, US

Assignee:

INTEL CORPORATION - SANTA CLARA CA

International Classification:

H01L 23/00
H01L 21/67
H01L 21/683
H01L 21/78
H01L 25/18
H01L 25/065

Abstract:

Described is an apparatus which comprises: a die having a first side and a second side opposite to the first side; a die backside film (DBF) or die attach film (DAF) disposed over the first side of the die; and a fluorocarbon layer disposed over the DBF or DAF. Described is a method which comprises: applying a die backside film (DBF) over a first side of a die, wherein the die has a second side which metal bumps; and applying a plasma polymerization process to treat the DBF with a fluorocarbon plasma.