Andrew C Sharpe

US Patent:

7470904, Dec 30, 2008

Filed:

Mar 20, 2006

Appl. No.:

11/385007

Inventors:

Paul Schweikert - Lompoc CA, US
William J. Parrish - Santa Barbara CA, US
Andrew Sharpe - Solvang CA, US
Vu L. Nguyen - Goleta CA, US
Marco Scussat - Santa Barbara CA, US

Assignee:

Flir Systems, Inc. - Wilsonville OR

International Classification:

H01L 23/02
G01J 5/00

US Classification:

2503381, 257680, 257682, 438106

Abstract:

Systems and methods for providing a sealed container having a reduced pressure atmosphere are disclosed. The container is suitable for housing an infrared detector array. Outgassing can be enhanced by adding features to solder preforms that maintain pathways for gasses to more readily exit the container prior to sealing thereof. Getters can be used to mitigate undesirable gases within the sealed container. One or more bolometers can be used to determine if the sealed container is leaking. A vacuum positioning fixture can be used to assemble the components of the infrared detector assembly and to place the infrared detector assemblies into a vacuum chamber. The cost of manufacturing such infrared detector assemblies may be reduced and the reliability thereof enhanced.

US Patent:

7752742, Jul 13, 2010

Filed:

Aug 19, 2008

Appl. No.:

12/194461

Inventors:

Paul Schweikert - Lompoc CA, US
William J. Parrish - Santa Barbara CA, US
Andrew Sharpe - Solvang CA, US
Vu L. Nguyen - Goleta CA, US
Marco Scussat - Santa Barbara CA, US

Assignee:

Flir Systems, Inc. - Wilsonville OR

International Classification:

B23P 19/00

US Classification:

29743, 29840, 29832, 29854, 29739, 29759, 2503381, 228 447, 228 495, 228 496, 228 53, 228213

Abstract:

Systems and methods for providing a sealed container having a reduced pressure atmosphere are disclosed. The container is suitable for housing an infrared detector array. Outgassing can be enhanced by adding features to solder preforms that maintain pathways for gasses to more readily exit the container prior to sealing thereof. Getters can be used to mitigate undesirable gases within the sealed container. One or more bolometers can be used to determine if the sealed container is leaking. A vacuum positioning fixture can be used to assemble the components of the infrared detector assembly and to place the infrared detector assemblies into a vacuum chamber. The cost of manufacturing such infrared detector assemblies may be reduced and the reliability thereof enhanced.

US Patent:

20170372920, Dec 28, 2017

Filed:

Aug 21, 2017

Appl. No.:

15/682459

Inventors:

- Wilsonville OR, US
Andrew Sharpe - Solvang CA, US
Gregory A. Carlson - Goleta CA, US
Alex Matson - Goleta CA, US
Scott Vilander - Santa Barbara CA, US
Bob Zahuta - Santa Barbara CA, US
Richard M. Goeden - Goleta CA, US

International Classification:

H01L 21/50
B81C 1/00
H01L 21/67
H01L 31/0203
H01L 21/683
H01L 21/68
H01L 21/677
H01L 31/09
H01L 23/00

Abstract:

An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

US Patent:

20170328779, Nov 16, 2017

Filed:

Dec 5, 2016

Appl. No.:

15/369702

Inventors:

- Wilsonville OR, US
Alex Matson - Goleta CA, US
Andrew Sharpe - Solvang CA, US
Davey Beard - Santa Barbara CA, US
Paul Schweikert - Ventura CA, US
Robert Simes - Santa Barbara CA, US

International Classification:

G01J 5/20
G01J 1/02
H01L 27/146
H01L 27/146
H01L 27/146
H01L 27/146
H01L 27/146
H01L 27/146
H01L 21/66
H01L 21/66
H01L 27/146
G01J 5/04
G01J 5/02
G01J 1/44
H01L 37/02
G01J 5/20

Abstract:

An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.

US Patent:

20160047691, Feb 18, 2016

Filed:

Jan 25, 2013

Appl. No.:

13/750709

Inventors:

FLIR Systems, Inc. - , US
Alex Matson - Goleta CA, US
Andrew Sharpe - Solvang CA, US
Davey Beard - Santa Barbara CA, US
Paul Schweikert - Ventura CA, US
Robert Simes - Santa Barbara CA, US

Assignee:

FLIR Systems, Inc. - Wilsonville OR

International Classification:

G01J 5/10
H01L 27/146
G01J 1/02
G01J 1/44
G01J 5/02

Abstract:

An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.

US Patent:

20140186999, Jul 3, 2014

Filed:

Dec 26, 2013

Appl. No.:

14/141300

Inventors:

- Wilsonville OR, US
Andrew Sharpe - Solvang CA, US
Gregory A. Carlson - Goleta CA, US
Alex Matson - Goleta CA, US
Scott Vilander - Santa Barbara CA, US
Bob Zahuta - Santa Barbara CA, US
Richard M. Goeden - Goleta CA, US

Assignee:

FLIR Systems, Inc. - Wilsonville OR

International Classification:

H01L 21/50

US Classification:

438106, 29 2501

Abstract:

An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.