Andrew M Yaung

US Patent:

7511228, Mar 31, 2009

Filed:

Sep 14, 2005

Appl. No.:

11/227332

Inventors:

Andrew Yaung - Fremont CA, US
Neal S. Greenberg - Fremont CA, US

Assignee:

Schmartboard, Inc. - Fremont CA

International Classification:

H05K 1/03

US Classification:

174255

Abstract:

A printed circuit board including a substrate, a plurality of traces on the substrate and a solder mask over the conductive traces. Apertures in the mask expose a plurality of connective pads on the substrate. The mask creates grooves which surround the mounting pads.

US Patent:

20090250246, Oct 8, 2009

Filed:

Apr 7, 2008

Appl. No.:

12/099056

Inventors:

Andrew Yaung - Fremont CA, US
Neal S. Greenberg - Fremont CA, US

International Classification:

H05K 1/00

US Classification:

174250, 361748, 361760

Abstract:

An electronic circuit assembly comprises a printed circuit board including a plurality of electrically-conductive traces disposed on at least one face of the printed circuit board and a circuit schematic layout. The plurality of electrically-conductive traces is configured to mount and electrically couple a plurality of types of electronic devices. The circuit schematic layout includes a map arranged similarly to the layout of the plurality of electrically-conductive traces disposed on the at least one face of the printed circuit board. A plurality of layout column markers and a plurality of layout row markers and a plurality of color-coded regions are marked directly onto the map. Each color of the plurality of color-coded regions is indicative of a particular one of the plurality of types of electronic devices.

US Patent:

20090260862, Oct 22, 2009

Filed:

Apr 16, 2008

Appl. No.:

12/104330

Inventors:

Andrew Yaung - Fremont CA, US
Neal S. Greenberg - Fremont CA, US

International Classification:

H05K 1/11

US Classification:

174259

Abstract:

An electronic circuit modification apparatus to repair or modify portions of a printed circuit board comprises an adhesive layer, an insulating layer formed over the adhesive layer, and a plurality of electrically-conductive traces having an electrically-conductive bonding layer formed thereupon. The electrically-conductive bonding layer is configured to mechanically mount and electrically couple to a lead of an electrical component. At least one masking layer is positioned to electrically isolate the plurality of electrically-conductive traces, one from another.

US Patent:

7203074, Apr 10, 2007

Filed:

Dec 16, 2003

Appl. No.:

10/738405

Inventors:

Andrew Yaung - Fremont CA, US
Neal S. Greenberg - Fremont CA, US
Che Wai Yeung - Milpitas CA, US

Assignee:

Intellect Lab, LLC - Fremont CA

International Classification:

H05K 1/14

US Classification:

361784, 361740, 361785, 361803, 439 65, 29830

Abstract:

Electronic Circuit Building Blocks are mechanically connected to each other to form larger circuit boards using a mechanical bridge connector. The Electronic Circuit Building Blocks include female interlocking elements formed on its edges, and the mechanical bridge connector includes male interlocking elements. Half parts of the male interlocking elements of the mechanical bridge connector are inserted into the corresponding female interlocking elements of the Electronic Circuit Building Blocks from one side of the circuit board. The Electronic Circuit Building Blocks include through-holes for mounting through-hole components and/or surface-mount pads for mounting surface-mount components. The Electronic Circuit Building Blocks also include traces interconnecting two or more of the through-hole components and the surface-mount components.

Address:

5473 Shattuck Ave, Fremont, CA 94555

Phone:

(510)8287817

VIN:

4JGBF71E37A189074

Make:

MERCEDES-BENZ

Model:

GL-CLASS

Year:

2007