Ann E Erickson

US Patent:

20220380894, Dec 1, 2022

Filed:

Aug 4, 2022

Appl. No.:

17/880855

Inventors:

- Fremont CA, US
Devin RAMDUTT - Fremont CA, US
Ann ERICKSON - Lake Oswego OR, US

International Classification:

C23C 16/44
H01L 21/67
H01L 21/687
C23C 16/505
C23C 16/46

Abstract:

A method is provided and includes: determining a temperature distribution pattern across a substrate or a support plate of a substrate support; determining, based on the temperature distribution pattern, a number of masks to apply to a top surface of the support plate, where the number of masks is greater than or equal to two; and determining patterns of the masks based on the temperature distribution pattern; and applying the masks over the top surface. The method further includes: performing a first machining process to remove a portion of the support plate unprotected by the masks to form first mesas and first recessed areas between the first mesas; removing a first mask from the support plate; performing a second machining process to form second recessed areas and at least one of second mesas or a first seal band area; and removing a second mask from the support plate.

US Patent:

20220285136, Sep 8, 2022

Filed:

Jul 30, 2020

Appl. No.:

17/631984

Inventors:

- Fremont CA, US
Xinwei HUANG - San Jose CA, US
Alexander Miller PATERSON - San Jose CA, US
Ann ERICKSON - Lake Oswego OR, US
Joanna WU - Fremont CA, US
Seetharaman RAMACHANDRAN - San Jose CA, US
Christopher KIMBALL - San Jose CA, US
Aris PEREZ - Fremont CA, US

International Classification:

H01J 37/32
H01L 21/687

Abstract:

An edge ring system for a substrate processing system includes a top edge ring including an annular body having an inner diameter and an outer diameter. The outer diameter of the top edge ring is smaller than a horizontal opening of a substrate port of the substrate processing system. A first edge ring is arranged below the top edge ring including an annular body having an inner diameter and an outer diameter. The outer diameter of the first edge ring is larger than the substrate port of the substrate processing system. The inner diameter of the first edge ring is smaller than the inner diameter of the top edge ring.