Abstract:
This invention relates to a heat curing process and to a solventless screen printable, heat curable conductive ink composition comprising (1) an ethylenically unsaturated member of the group consisting of (a) a liquid, ethylenically, unsaturated monomer, oligomer or prepolymer of the formula: ##STR1## wherein R is H or CH. sub. 3, R. sub. 1 is an organic moiety and n is at least 2, (b) a polythiol in combination with (a) supra, (c) a polythiol in combination with a liquid ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR2## wherein R. sub. 2 is H or CH. sub. 3, R. sub. 3 is an organic moiety and n is at least 2, and (d) mixtures of (a), (b) and (c), (2) a thermal initiator, and (3) an electrically conductive material. Heating of the composition in a desired pattern on a substrate results in a printed electric circuit.