Avery Yee Quil

US Patent:

7631414, Dec 15, 2009

Filed:

Aug 13, 2007

Appl. No.:

11/891774

Inventors:

Avery Y. Quil - San Pedro CA, US
Clifton Quan - Arcadia CA, US
Alec Ekmekji - Los Angeles CA, US
Jason G. Milne - El Segundo CA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H01Q 13/00
H01Q 17/00

US Classification:

29600, 29601, 29842, 29884, 343700, 343767, 3437925, 343785, 156285

Abstract:

Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structure and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.

US Patent:

8209846, Jul 3, 2012

Filed:

Sep 25, 2009

Appl. No.:

12/567476

Inventors:

Avery Y. Quil - San Pedro CA, US
Clifton Quan - Arcadia CA, US
Jason G. Milne - El Segundo CA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H01Q 13/00
H01Q 21/00

US Classification:

29600, 29601, 29830, 29884, 156285, 343746, 343767, 343785, 3437925

Abstract:

Methods for assembling an active array system are described. In one exemplary embodiment, an active subarray panel assembly having a first surface with a first array of electrical contacts and a radiator aperture with an array of radiator structures and an aperture mounting surface with a second array of electrical contacts are assembled together. The first surface of the panel assembly and the aperture mounting surface of the radiator aperture are brought into contact with an adhesive layer including microwave interconnects in a pattern corresponding to the first array of electrical contacts and the second array of electrical contacts so that the adhesive layer is between the first surface of the panel assembly and the aperture mounting surface of the radiator aperture. Pressure, heat and vacuum are applied to cure the adhesive and complete engagement of the microwave interconnects.

US Patent:

59306653, Jul 27, 1999

Filed:

Dec 5, 1997

Appl. No.:

8/985750

Inventors:

Ching-Fai Cho - Tujunga CA
Helmut Carl Maiershofer - Valencia CA
Do Bum Shin - Santa Clarita CA
Avery Yee Quil - Simi Valley CA

Assignee:

ITT Industries, Inc. - White Plains NY

International Classification:

H01L 2144

US Classification:

438612

Abstract:

A multi-layer circuit structure including a plurality of substrate layers. At least one planar transmission line, including microstrip, stripline, or coplanar line, disposed on the plurality of substrate layers. A via transmission line connected to that at least one planar transmission line and extending through the plurality of substrate layers. The via transmission lines having the same topology as the at least one planar transmission line for providing wide frequency band transition between the via transmission lines and the at least one planar transmission line.

US Patent:

57572526, May 26, 1998

Filed:

Jun 11, 1996

Appl. No.:

8/661557

Inventors:

Ching-Fai Cho - Tujunga CA
Helmut Carl Maiershofer - Valencia CA
Do Bum Shin - Santa Clarita CA
Avery Yee Quil - Simi Valley CA

Assignee:

ITT Industries, Inc. - White Plains NY

International Classification:

H01P 308
H01P 500
H05K 111

US Classification:

333246

Abstract:

A multi-layer circuit structure including a plurality of substrate layers. At least one planar transmission line, including microstrip, stripline, or coplanar line, disposed on the plurality of substrate layers. A via transmission line connected to that at least one planar transmission line and extending through the plurality of substrate layers. The via transmission lines having the same topology as the at least one planar transmission line for providing wide frequency band transition between the via transmission lines and the at least one planar transmission line.