Bao T Tran

US Patent:

7019391, Mar 28, 2006

Filed:

Feb 23, 2005

Appl. No.:

11/064363

Inventors:

Bao Tran - San Jose CA, US

International Classification:

H01L 23/02
H01L 23/495

US Classification:

257678, 257666, 257677, 257672, 257 98

Abstract:

Systems and methods are disclosed to dissipate heat from a semiconductor substrate. A package for integrated circuit includes a chip having a plurality of chip pads adapted to receive the variety of signals from or to output the same to an external circuit; a lead frame having a plurality of contact points each corresponding to a chip pad; and nano ceramic material in thermal communication with the chip for removing heat from the chip.

US Patent:

7224642, May 29, 2007

Filed:

Jan 26, 2006

Appl. No.:

11/340733

Inventors:

Bao Q. Tran - San Jose CA, US

International Classification:

G01V 1/00

US Classification:

367 77, 702 14, 370338

Abstract:

A wireless network includes a plurality of sensors; and a wireless station adapted to communicate with the plurality of sensors, each wireless station having a positioning system to provide 3D coordinates, each wireless station being part of a mesh network and each wireless station automatically determining the 3D coordinates of each sensor based on the mesh network.

US Patent:

7330369, Feb 12, 2008

Filed:

Feb 23, 2005

Appl. No.:

11/064364

Inventors:

Bao Tran - San Jose CA, US

International Classification:

H01L 29/00

US Classification:

365151, 257 5, 257202, 257204, 257211, 257E29001, 257109

Abstract:

Systems and methods are disclosed to process a semiconductor substrate by fabricating a first layer on the substrate using semiconductor fabrication techniques; fabricating a second layer above the first layer having one or more NANO-bonding areas; self-assemblying one or more NANO-elements; and bonding the NANO-elements to the NANO-bonding areas.

US Patent:

7375417, May 20, 2008

Filed:

Jan 26, 2006

Appl. No.:

11/340349

Inventors:

Bao Tran - San Jose CA, US

International Classification:

H01L 23/02
H01L 23/495

US Classification:

257678, 257E23033, 257E27151

Abstract:

A package for an integrated circuit includes a chip having a plurality of nodes adapted to receive signals from or to output signals to an external circuit; and a frame having a plurality of contact points each coupled to one node of the chip and to a pad, wherein each pad comprises a nano material.

US Patent:

7393699, Jul 1, 2008

Filed:

Jun 12, 2006

Appl. No.:

11/451161

Inventors:

Bao Q. Tran - San Jose CA, US

International Classification:

H01L 21/00

US Classification:

438 1, 977894

Abstract:

Systems and methods are disclosed to fabricate an electronic device on a substrate by genetically engineering first, second, third, and fourth viruses each having a plurality of selective binding sites; forming first, second, third, and fourth viral biotemplates by immersing the first, second, third, and fourth viruses in one or more solutions with nano materials coupleable to the binding sites of the viruses; self-assembling a gate with the first viral biotemplate having one site attachable to the substrate; self-assembling a source above the gate with the second viral biotemplate; self-assembling a channel with the third viral biotemplate having one site attachable to the second viral biotemplate; and self-assembling a drain with the fourth viral biotemplate having one site attachable to the third viral biotemplate.

US Patent:

7420472, Sep 2, 2008

Filed:

Oct 16, 2005

Appl. No.:

11/252279

Inventors:

Bao Tran - San Jose CA, US

International Classification:

G08B 1/08
G08B 23/00

US Classification:

3405731, 3405391, 34053911, 34053912, 34053913

Abstract:

A monitoring system includes one or more cameras to determine a three dimensional (3D) model of a person; means to detect a dangerous condition based on the 3D model; and means to generate a warning when the dangerous condition is detected.

US Patent:

7489537, Feb 10, 2009

Filed:

Oct 4, 2007

Appl. No.:

11/867566

Inventors:

Bao Tran - San Jose CA, US

International Classification:

H01L 29/00

US Classification:

365151, 257 5, 257202, 257204, 257211, 257109

Abstract:

A memory device includes an array of memory cells disposed in rows and columns and constructed over a substrate, each memory cell comprising a first signal electrode, a second signal electrode, and a nano-layer disposed in the intersecting region between the first signal electrode and the second signal electrode; a plurality of word lines each connecting the first signal electrodes of a row of memory cells; and a plurality of bit lines each connecting the second signal electrodes of a column of memory cells.

US Patent:

7502498, Mar 10, 2009

Filed:

Sep 10, 2004

Appl. No.:

10/938783

Inventors:

Huafeng Wen - Redwood Shores CA, US
Bao Tran - Santa Clara CA, US

Assignee:

Available For Licensing - San Jose CA

International Classification:

G06K 9/00

US Classification:

382128, 128922

Abstract:

A monitoring system includes one or more cameras to determine a three dimensional (3D) model of a person; means to detect a dangerous condition based on the 3D model; and means to generate a warning when the dangerous condition is detected.