Barry Dale

US Patent:

20120200993, Aug 9, 2012

Filed:

Feb 9, 2011

Appl. No.:

13/024032

Inventors:

Russell S. Aoki - Tacoma WA, US
Anthony P. Valpiani - Graham WA, US
Barry T. Dale - DuPont WA, US
Chia-Pin Chiu - Tempe AZ, US

International Classification:

G06F 1/16
B23P 17/04
H01R 12/62

US Classification:

36167902, 439 71, 29428

Abstract:

A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.

US Patent:

20150227174, Aug 13, 2015

Filed:

Jul 30, 2013

Appl. No.:

14/126285

Inventors:

- Santa Clara CA, US
Peter Bristol - Seattle WA, US
Michael S. Brazel - Fedeal Way WA, US
Kristin L. Weihl - Dupont WA, US
Stella Latscha - NE Olympia WA, US
Alexander D. Williams - DuPont WA, US
Nicolas Kurczewski - Dupont WA, US
Barry T. Dale - DuPont WA, US
Stephen J. Allen - Santa Clara CA, US
Patrick S. Johnson - Olympia WA, US

International Classification:

G06F 1/16
E05D 11/08

Abstract:

In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.

US Patent:

20140082915, Mar 27, 2014

Filed:

Nov 26, 2013

Appl. No.:

14/090493

Inventors:

Russell S. Aoki - Tacoma WA, US
Anthony P. Valpiani - Olympia WA, US
Barry T. Dale - DuPont WA, US
Chia-Pin Chiu - Tempe AZ, US

International Classification:

G06F 1/16

US Classification:

29428

Abstract:

A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.