Benjamin A Clark

US Patent:

7140725, Nov 28, 2006

Filed:

Jun 17, 2003

Appl. No.:

10/464281

Inventors:

Gregory S Herman - Albany OR, US
Benjamin Clark - Corvallis OR, US
Peter Mardilovich - Corvallis OR, US
James O'Neil - Corvallis OR, US
David Champion - Lebanon OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J 2/01

US Classification:

347101, 347105

Abstract:

Disclosed herein are methods for applying crystalline materials to a substrate by applying a cation and an anion and crystallizing at least a portion of the reaction product of the cation and the anion. The application of at least one of the cation or the anion is actively controlled such that it is applied in a patternwise or blanketwise fashion.

US Patent:

7293359, Nov 13, 2007

Filed:

Apr 29, 2004

Appl. No.:

10/834777

Inventors:

Mohammed S. Shaarawi - Corvallis OR, US
Benjamin L. Clark - Corvallis OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B21D 53/76
G01D 15/00

US Classification:

298901, 29830, 29831, 29832, 216 27

Abstract:

A method for manufacturing a fluid ejection device includes providing a sacrificial structure substantially overlying a semiconductor substrate. The structure has a shape configured to define an ink chamber, ink manifold, and a nozzle. The method also includes providing a first metal adjacent the sacrificial structure and substantially overlying the substrate and removing the sacrificial structure to form the ink chamber and the nozzle. The method further includes removing a portion of the first and second sacrificial materials to form the sacrificial structure.

US Patent:

7543915, Jun 9, 2009

Filed:

Sep 29, 2007

Appl. No.:

11/906039

Inventors:

Mohammed S. Shaarawi - Corvallis OR, US
Benjamin L. Clark - Corvallis OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J 2/05

US Classification:

347 56, 347 63, 347 64

Abstract:

A method for manufacturing a fluid ejection device includes providing a sacrificial structure substantially overlying a semiconductor substrate. The structure has a shape configured to define an ink chamber, ink manifold, and a nozzle. The method also includes providing a first metal adjacent the sacrificial structure and substantially overlying the substrate and removing the sacrificial structure to form the ink chamber and the nozzle. The method further includes removing a portion of the first and second sacrificial materials to form the sacrificial structure.

US Patent:

7612859, Nov 3, 2009

Filed:

Oct 31, 2005

Appl. No.:

11/263525

Inventors:

Benjamin L. Clark - Corvallis OR, US
Sadiq S. Bengali - Corvallis OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

G02F 1/1339
G02F 1/1333

US Classification:

349156, 349110, 349157

Abstract:

Various embodiments and methods relating to an ultra-violet radiation absorbing grid for attenuating transmission of near UV-light are disclosed.

US Patent:

8042908, Oct 25, 2011

Filed:

Jul 27, 2007

Appl. No.:

11/829354

Inventors:

Benjamin Clark - Corvallis OR, US
Jeremy Harlan Donaldson - Corvallis OR, US
Mark Sanders Taylor - Monmouth OR, US
Joe E. Stout - Corvallis OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J 2/135

US Classification:

347 45, 347 56, 347 44, 347 47

Abstract:

A fluid ejector device, including: a fluid nozzle layer defining an orifice therein; and at least one epoxy resin layer established on the nozzle layer, the at least one epoxy resin layer having first and second opposed surfaces with a thickness there between and a fluorine gradient formed therein such that the gradient extends into at least a portion of the thickness of the at least one epoxy resin layer, wherein an amount of a fluorinated species present in the at least one epoxy resin layer at the first opposed surface is greater than an amount of the fluorinated species present in the at least one epoxy resin layer at the second opposed surface that is adjacent the fluid nozzle layer.

US Patent:

20050019637, Jan 27, 2005

Filed:

Jul 23, 2003

Appl. No.:

10/626352

Inventors:

Gregory Herman - Albany OR, US
Benjamin Clark - Corvallis OR, US
Peter Mardilovich - Corvallis OR, US

International Classification:

H01M008/12
H01M004/86
B05D005/12
B05D003/02

US Classification:

429033000, 427115000, 429040000, 427372200, 429038000

Abstract:

A method for forming a fuel cell component includes depositing a hydroxide or oxyhydroxide form of the component, and hydrothermally dehydrating the hydroxide or oxyhydroxide form of the component, wherein the hydrothermally dehydrating of the component establishes the grain structure of the component.

US Patent:

20090032812, Feb 5, 2009

Filed:

Jul 31, 2007

Appl. No.:

11/888072

Inventors:

Gregory Herman - Albany OR, US
Benjamin Clark - Corvallis OR, US
Zhizhang Chen - Corvallis OR, US

International Classification:

H01L 29/24
H01L 21/34

US Classification:

257 43, 438104, 257E291, 257E2146

Abstract:

A microelectronic device includes a thin film transistor having an oxide semiconductor channel and an organic polymer passivation layer formed on the oxide semiconductor channel.

US Patent:

20100304496, Dec 2, 2010

Filed:

Jun 1, 2009

Appl. No.:

12/475714

Inventors:

Jeffrey A. Nielsen - Corvallis OR, US
Jeremy Hartan Donaldson - Corvallis OR, US
Benjamin Clark - Corvallis OR, US
Debora J. Thomas - Corvallis OR, US

International Classification:

G01N 31/16
B01L 3/02
B65D 47/18

US Classification:

436163, 222 1, 222421, 422 75

Abstract:

The present invention is embodied in a method for precisely dispensing fluid, including treating an orifice of a fluid dispensing apparatus during a fabrication process by applying a low surface energy material layer onto the orifice, adjusting a thickness of the low surface energy material coating to a predetermined threshold and limiting backpressure of a low dead volume fluid delivery system coupled to the orifice to reduce interference or interruptions for precisely dispensing the fluid.