Benjamin R Neff

US Patent:

7199249, Apr 3, 2007

Filed:

Jul 3, 2002

Appl. No.:

10/190299

Inventors:

Puwei Liu - San Diego CA, US
Stephen M. Dershem - San Diego CA, US
Benjamin Neff - San Diego CA, US
Maria Villegas - San Diego CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

C07F 7/10
C07F 7/18
C07D 207/24

US Classification:

548406, 556407, 556465, 428355 R

Abstract:

In accordance with the present invention, there are provided novel coupling agents which are compatible with a wide variety of adhesive formulations and which provide substantial adhesion enhancement relative to base formulations to which they are added. Invention compounds comprise at least one free-radically polymerizable group (other than acrylate) and at least one reactive moiety which forms covalent bond(s) with substrates having free hydroxyl groups on the surface thereof. Thus, invention compounds are covalently linked to adhesive formulations upon free radical cure, while at the same time providing “residual” functionality which is capable of undergoing reaction with any substrate having reactive (e. g. , hydroxyl) groups in the surface thereof.

US Patent:

20050288457, Dec 29, 2005

Filed:

Oct 20, 2003

Appl. No.:

10/531723

Inventors:

Puwei Liu - San Diego CA, US
Benjamin Neff - San Diego CA, US
Zhengjue Zhang - San Diego CA, US
Kang Yang - San Diego CA, US

International Classification:

C08L063/00
H01L021/50
B32B027/38

US Classification:

525529000, 525535000, 438118000, 428413000, 428414000

Abstract:

The present invention provides co-curable compositions in which an anionically or cationically reactive component, such as an epoxy or episulfide resin component; a free-radical polymerizable component; and a cross linking component, where the cross linking component is reactive with each of the anionically or cationically reactive component and the free radical polymerizable component through functionalization with at least one group reactive through an anionic or cationic mechanism and at least one group reactive through a free radical mechanism. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

US Patent:

57897573, Aug 4, 1998

Filed:

Sep 10, 1996

Appl. No.:

8/711982

Inventors:

Frank D. Husson - San Diego CA
Benjamin Neff - Chula Vista CA

Assignee:

The Dexter Corporation - Windsor Locks CT

International Classification:

C09K 300

US Classification:

25218311

Abstract:

In accordance with the present invention, there are provided novel compositions based on a defined maleimide moiety. Invention compositions have excellent moisture resistance (and, hence are much less prone to give rise to "popcorning"), excellent handling properties (i. e. , generally existing as a fluid material which does not require the addition of solvent to facilitate the use thereof), and excellent performance properties (e. g. , good dielectric properties).

US Patent:

61878863, Feb 13, 2001

Filed:

Jun 29, 1998

Appl. No.:

9/107897

Inventors:

Frank D. Husson - San Diego CA
Benjamin Neff - Chula Vista CA
Stephen M. Dershem - San Diego CA

Assignee:

Dexter Corporation - Windsor Locks CT

International Classification:

B32B 2706
B32B 2728
C08F12240
C08F22240

US Classification:

526262

Abstract:

In accordance with the present invention, there are provided novel hydrophobic compositions comprising a defined hydrophobic maleimide moiety and optionally, a hydrophobic cyanate ester moiety. Invention compositions have excellent moisture resistance (and, hence are much less prone to give rise to "popcorning"), excellent handling properties (i. e. , generally existing as a fluid material which does not require the addition of solvent to facilitate the use thereof), and excellent performance properties (e. g. , good dielectric properties).