Betty Lee Berdan

US Patent:

48986470, Feb 6, 1990

Filed:

Dec 22, 1988

Appl. No.:

7/288472

Inventors:

Betty M. Luce - Willowick OH
Betty L. Berdan - Willowick OH

Assignee:

Gould, Inc. - Eastlake OH

International Classification:

C25O 104

US Classification:

204 13

Abstract:

The present invention involves a process and associated apparatus for producing surface treated metal foil, comprising: providing an electrolytic cell having an electrolyte and a cathodic surface immersed in the electrolyte, the electrolyte containing a concentration of matel ions; applying a first current density in a frist zone for plating a relatively smooth metal foil deposit on the cathodic surface; and applying a pulsed second current density having a magnitude greater than the limiting current density in a subsequent second zone, the pulsed second current density forming a plurality of self adhering nodules on the base metal deposit.

US Patent:

43117686, Jan 19, 1982

Filed:

Sep 19, 1979

Appl. No.:

6/077051

Inventors:

Betty L. Berdan - Willowick OH
Betty M. Luce - Willowick OH

Assignee:

Gould Inc. - Rolling Meadows IL

International Classification:

B32B 1508

US Classification:

428626

Abstract:

A readily etchable printed circuit board is provided which comprises a resinous substrate having bonded to at least one surface thereof a composite metal structure. This metal structure includes a layer of copper foil having opposed first and second surfaces and a thin layer of nickel having opposed first and second surfaces with one of the surfaces of the copper foil being bonded to one of the surfaces of the nickel layer and the opposite opposed surface of the nickel layer being bonded to the resinous substrate with the nickel layer containing an effective amount of sulfur to render the copper foil and the nickel barrier layer mutually etchable, i. e. , etchable by the same etchant. The preferred amount of sulfur ranges from about 0. 05 to about 10.

US Patent:

41690184, Sep 25, 1979

Filed:

Jan 16, 1978

Appl. No.:

5/869687

Inventors:

Betty L. Berdan - Willowick OH
Betty M. Luce - Willowick OH

Assignee:

Gould Inc. - Rolling Meadows IL

International Classification:

C25D 104

US Classification:

204 13

Abstract:

An improved copper electroplating method typically for use on a carrier material such as aluminum is provided by pretreating of the carrier surface and electrodepositing copper foil utilizing a single-step copper plating process comprising an acidic plating bath containing copper, nitrate, and fluoride ions which can be operated at a single-current density.

US Patent:

39691993, Jul 13, 1976

Filed:

Jul 7, 1975

Appl. No.:

5/593894

Inventors:

Betty L. Berdan - Willowick OH
Betty M. Luce - Willowick OH

Assignee:

Gould Inc. - Rolling Meadows IL

International Classification:

C25D 544
C25D 100

US Classification:

204 33

Abstract:

An improvement in providing a mechanically strippable copper plate on an aluminum carrier is achieved by pretreating the aluminum carrier with an alkaline, aqueous, alkali metal zincate composition containing a small amount of one or more water soluble iron, cobalt or nickel salts, and removing substantially all of the deposited zincate coating with acid prior to copper plating.

US Patent:

43236324, Apr 6, 1982

Filed:

Aug 15, 1980

Appl. No.:

6/178451

Inventors:

Betty L. Berdan - Willowick OH
William M. King - Mentor OH

Assignee:

Gould Inc. - Rolling Meadows IL

International Classification:

B32B 1508
B32B 1520

US Classification:

428626

Abstract:

A metal composite comprising a substrate having a uniformly, mildly etched surface of an aluminum alloy, e. g. an alloy, consisting of at least about 99 wt. % aluminum, and the balance comprising specified quantities of silicon, iron, copper, manganese and zinc, and a uniformly adhering, electrocathodically deposited copper foil. The resulting peel strength between the aluminum alloy surface and the copper foil, after lamination of the composite to a resinous substrate under heat and pressure is within the range of from about 6 to about 8 lbs. /in. of width of copper foil. This can be reduced to a value within the range of about 0. 3 to about 2 lbs. /in. of width by overplating the copper foil with a layer of zinc or indium. The resinous substrate may be a glass fiber reinforced epoxy resin, such as is used in the manufacture of printed circuit boards.

US Patent:

42343950, Nov 18, 1980

Filed:

Oct 18, 1978

Appl. No.:

5/952512

Inventors:

Betty L. Berdan - Willowick OH
William M. King - Mentor OH

Assignee:

Gould Inc. - Rolling Meadows IL

International Classification:

C25D 104
C25D 544

US Classification:

204 12

Abstract:

A metal composite comprising a substrate having a uniformly, mildly etched surface of an aluminum alloy, e. g. an alloy, consisting of at least about 99 wt. % aluminum, and the balance comprising specified quantities of silicon, iron, copper, manganese and zinc, and a uniformly adhering, electrocathodically deposited copper foil. The resulting peel strength between the aluminum alloy surface and the copper foil, after lamination of the composite to a resinous substrate under heat and pressure is within the range of from about 6 to about 8 lbs. /in. of width of copper foil. This can be reduced to a value within the range of about 0. 3 to about 2 lbs. /in. of width by overplating the copper foil with a layer of zinc or indium. The resinous substrate may be a glass fiber reinforced epoxy resin, such as is used in the manufacture of printed circuit boards.

US Patent:

42604494, Apr 7, 1981

Filed:

Sep 19, 1979

Appl. No.:

6/077465

Inventors:

Betty L. Berdan - Willowick OH
Betty M. Luce - Willowick OH

Assignee:

Gould Inc. - Rolling Meadows IL

International Classification:

B44C 122

US Classification:

156628

Abstract:

A readily etchable printed circuit board is provided which comprises a resinous substrate having bonded to at least one surface thereof a composite metal structure. This metal structure includes a layer of copper foil having opposed first and second surfaces and a thin layer of nickel having opposed first and second surfaces with one of the surfaces of the copper foil being bonded to one of the surfaces of the nickel layer and the opposite opposed surface of the nickel layer being bonded to the resinous substrate with the nickel layer containing an effective amount of sulfur to render the copper foil and the nickel barrier layer mutually etchable, i. e. , etchable by the same etchant. The preferred amount of sulfur ranges from about 0. 05 to about 10.

US Patent:

41904745, Feb 26, 1980

Filed:

Dec 22, 1977

Appl. No.:

5/863109

Inventors:

Betty L. Berdan - Willowick OH
Betty M. Luce - Willowick OH

Assignee:

Gould Inc. - Rolling Meadows IL

International Classification:

C25D 100

US Classification:

156151

Abstract:

A readily etchable printed circuit board is provided which comprises a resinous substrate having bonded to at least one surface thereof a composite metal structure. This metal structure includes a layer of copper foil having opposed first and second surfaces and a thin layer of nickel having opposed first and second surfaces with one of the surfaces of the copper foil being bonded to one of the surfaces of the nickel layer and the opposite opposed surface of the nickel layer being bonded to the resinous substrate with the nickel layer containing an effective amount of sulfur to render the copper foil and the nickel barrier layer mutually etchable, i. e. , etchable by the same etchant. The preferred amount of sulfur ranges from about 0. 05 to about 10.