Skills:
Nano-and-Micro fabrication: Class 1-10-100 Cleanroom process, Photolithography (MJB3), E-beam lithography (EBL, NPGS and Raith System), Etching (Plasma, Chemical and Reactive-ion or RIE) Thin Film deposition technique: E-beam evaporator (Kurt Lesker, CHA), Thermal evaporator (Edward) Nano-material, synthesis/growth: Chemical vapor deposition (CVD), Exfoliated, and Epitaxial Graphene and other two-dimensional (2D) materials, Carbon nanotubes, Organic semiconductors, Dielectrophoresis, Transfer and pattering graphene to various substrates such as Si/SiO2, SiC, STO, and LNB Process characterization: SEM (Zeiss ultra-55), AFM (Veeco, NT-MDT), Raman (Xplora), Optical microscopy Device characterization: Electric characterization, Lock-in amplifier, Source-meter, Semiconductor analyzer, Cryogenic measurement, Optical characterization using laser (UV, NIR, IR), and radiation source (X-ray and Gamma-ray) Modelling and Simulation: Comsol Multiphysics, Quick Field, FlexPDE, Matlab, Experience in C++ and LabView Data analysis and Computer skills: DesignCAD, AutoCAD, NPGS, Raith, Igor pro, Origin, Microsoft Office, Quick field, Endnote. Familiar with Comsol Multiphysics, and Matlab Communication skill: Excellent writing (published 13 papers, wrote several proposals) and oral communication skills