Bob Tse-Weng Lin

US Patent:

20210269359, Sep 2, 2021

Filed:

Jul 8, 2019

Appl. No.:

17/260227

Inventors:

- Essen, DE
Maria NARGIELLO - Piscataway NJ, US
Bettina GERHARZ-KALTE - Hünfelden, DE
Björn LAZAR - Hasselroth, DE
Uwe NUMRICH - Gross-Zimmern, DE
Ulrich BOES - Frankfurt a.M., DE
Bob Tse-Weng LIN - Branchburg NJ, US
Craig BIESIADA - South Amboy NJ, US

Assignee:

EVONIK OPERATIONS GMBH - Essen

International Classification:

C04B 18/14
C04B 28/02
C04B 20/10

Abstract:

The present invention relates to a thermal insulating composition, containing 5 to 60% by weight of a hydrophobized granular material comprising fumed silica and at least one IR-opacifier, and 40 to 95% by weight of an inorganic and/or an organic binder, whereby the hydrophobized granular material has a content of free hydroxyl groups of no greater than 0.12 mmol/g, as determined by the reaction with lithium aluminium hydride.