Brenda C Gogue

US Patent:

7193305, Mar 20, 2007

Filed:

Nov 3, 2004

Appl. No.:

10/980355

Inventors:

Jeffrey Alan Miks - Chandler AZ, US
Curtis Michael Zwenger - Chandler AZ, US
Brenda Concepcion Gogue - Gilbert AZ, US
Stephen Gregory Shermer - Chandler AZ, US
Maximilien Jouchin d'Estries - Mesa AZ, US

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 23/02

US Classification:

257679, 257676, 257693, 257697, 257E23061, 257E23064

Abstract:

A memory card comprising a leadframe having a die pad, and an insert having a plurality of contacts. Attached to the die pad is a semiconductor die which is electrically connected to the contacts of the insert. A body covers the die pad and the semiconductor die and partially covers the insert such that the contacts are exposed in an exterior surface of the body.

US Patent:

7556986, Jul 7, 2009

Filed:

Jun 21, 2006

Appl. No.:

11/425502

Inventors:

Jeffrey Alan Miks - Chandler AZ, US
Curtis Michael Zwenger - Chandler AZ, US
Brenda Gogue - Gilbert AZ, US

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 21/00

US Classification:

438118, 438106, 438112, 438123, 438124, 438127, 257666, 257667, 257670, 257787, 257E23031, 257E23055

Abstract:

A method of fabricating a memory card. The method comprises the initial step of providing a leadframe which has a dambar and a plurality of contacts, each of the contacts being attached to the dambar by at least one tie bar. A layer of tape is applied to the leadframe such that the tape the bottom contact surfaces of the contacts, at least portions of the bottom dambar surface of the dambar. Thereafter, the tie bars are removed from the leadframe. At least one semiconductor die is electrically connected to the leadframe, with a body thereafter being formed on the leadframe such that the bottom contact surfaces are exposed in an exterior surface thereof.