Brian J Calhoun

US Patent:

8296941, Oct 30, 2012

Filed:

May 27, 2011

Appl. No.:

13/117284

Inventors:

David J. Hiner - Chandler AZ, US
Donald Joseph Leahy - Kernersville NC, US
David Jandzinski - Summerfield NC, US
Thomas Scott Morris - Lewisville NC, US
David Halchin - Summerfield NC, US
Milind Shah - San Diego CA, US
Mark Charles Held - High Point NC, US
Brian Howard Calhoun - Oak Ridge NC, US
Brian D. Sawyer - Menlo Park CA, US
Ulrik Riis Madsen - Herning, DK

Assignee:

RF Micro Devices, Inc. - Greensboro NC

International Classification:

H01L 24/97
H01L 23/552
H05K 3/30

US Classification:

29841, 29829, 29832, 257660, 438112, 361818

Abstract:

A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

US Patent:

20090000815, Jan 1, 2009

Filed:

Dec 7, 2007

Appl. No.:

11/952545

Inventors:

David J. Hiner - Chandler AZ, US
Donald Joseph Leahy - Kernersville NC, US
David Jandzinski - Summerfield NC, US
Thomas Scott Morris - Clemmons NC, US
David Halchin - Summerfield NC, US
Milind Shah - Greensboro NC, US
Mark Charles Held - High Point NC, US
Brian Howard Calhoun - Oak Ridge NC, US
Brian D. Sawyer - Carrboro NC, US
Ulrik Riis Madsen - Herning, DK

Assignee:

RF MICRO DEVICES, INC. - Greensboro NC

International Classification:

H05K 9/00
H05K 3/10

US Classification:

174350, 29846

Abstract:

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

US Patent:

20100199492, Aug 12, 2010

Filed:

Apr 23, 2010

Appl. No.:

12/766347

Inventors:

David J. Hiner - Chandler AZ, US
Donald Joseph Leahy - Kernersville NC, US
David Jandzinski - Summerfield NC, US
Thomas Scott Morris - Lewisville NC, US
David Halchin - Summerfield NC, US
Milind Shah - San Diego CA, US
Mark Charles Held - High Point NC, US
Brian Howard Calhoun - Oak Ridge NC, US
Brian D. Sawyer - Carrboro NC, US
Ulrik Riis Madsen - Herning, DK

Assignee:

RF MICRO DEVICES, INC. - Greensboro NC

International Classification:

H05K 3/00

US Classification:

29846

Abstract:

A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.