Brian R Fraser

US Patent:

7104268, Sep 12, 2006

Filed:

Jan 10, 2003

Appl. No.:

10/341425

Inventors:

Yi Wu - Irvine CA, US
Cole S. Franklin - San Clemente CA, US
Brian Fraser - Los Angeles CA, US
Thomas Nicolosi - Mission Viejo CA, US

Assignee:

Akrion Technologies, Inc. - Wilmington DE

International Classification:

B08B 6/00

US Classification:

134 13, 134 1, 134 31, 134 34, 134 42, 438906, 310311, 31031601, 310317

Abstract:

A wafer cleaning method and system including a combined high frequency signal, a low frequency signal, and in one embodiment a biased voltage signal, allows cleaning particles and impurities off of fine-structured wafers, through application of an acoustic field to the wafer through a cleaning liquid which fosters micro-bubble formation for effective cleaning while buffering micro-bubble growth which would otherwise damage the wafer.

US Patent:

7156111, Jan 2, 2007

Filed:

Jun 10, 2004

Appl. No.:

10/864929

Inventors:

Cole S. Franklin - San Clemente CA, US
Yi Wu - Irvine CA, US
Brian Fraser - Los Angeles CA, US

Assignee:

Akrion Technologies, Inc - Wilmington

International Classification:

B08B 3/00

US Classification:

134 13, 134 1, 134 34, 134 42, 438906

Abstract:

A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. In another aspect, the invention is a system for carrying out the method. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.

US Patent:

D582797, Dec 16, 2008

Filed:

Sep 15, 2008

Appl. No.:

29/324525

Inventors:

Brian Fraser - Atlanta GA, US
Ty Hagler - Durham NC, US
Hayden Williams - Austell GA, US
Hua Li - Roswell GA, US

Assignee:

Home Depot USA, Inc. - Atlanta GA

International Classification:

1003

US Classification:

D10 40

US Patent:

7578302, Aug 25, 2009

Filed:

Nov 9, 2006

Appl. No.:

11/595029

Inventors:

Cole S. Franklin - San Clemente CA, US
Yi Wu - Irvine CA, US
Brian Fraser - Los Angeles CA, US

International Classification:

B08B 3/00

US Classification:

134 13, 134 1, 134 34, 134 42, 438906

Abstract:

A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.

US Patent:

8459712, Jun 11, 2013

Filed:

Mar 5, 2009

Appl. No.:

12/398399

Inventors:

Charles T Thrasher - Dallas GA, US
Jeffrey M. Kornreich - Woodstock GA, US
Brian Fraser - Atlanta GA, US

Assignee:

Home Depot USA, Inc. - Atlanta GA

International Classification:

B66F 19/00

US Classification:

294209, 294 24, 2482192

Abstract:

An apparatus for coupling and decoupling clips is described. Specifically, the apparatus allows for installation of clips to building structures of varying elevations. The apparatus may comprise a telescoping pole, a lower pivot joint, an upper pivot joint, and at least one reversible clip. The reversible clip may be removed from the upper pivot joint by applying a substantially vertical force in a downward direction to the telescoping pole. Lights may be attached to the reversible clip. The lower pivot joint and upper pivot joint allow for the reversible clip to be coupled to building structures at various angles.

US Patent:

20060260641, Nov 23, 2006

Filed:

Jul 18, 2006

Appl. No.:

11/489059

Inventors:

Yi Wu - Irvine CA, US
Cole Franklin - San Clemente CA, US
Brian Fraser - Los Angeles CA, US
Thomas Nicolosi - Mission Viejo CA, US

International Classification:

B08B 3/12

US Classification:

134001000

Abstract:

An acoustic energy cleaning system and method which fosters micro-bubble formation for effective cleaning while buffering micro-bubble growth which would otherwise damage the wafer. In one embodiment, the invention includes combining a first frequency signal and a second frequency signal having a positive amplitude bias component so as to form a combined signal. The combined signal, which has a positive amplitude offset, is applied to a transducer system that converts the combined signal into acoustic waves. The acoustic waves can be applied to the object to be cleaned in a cleaning fluid.