Brian A Fraser

US Patent:

7104268, Sep 12, 2006

Filed:

Jan 10, 2003

Appl. No.:

10/341425

Inventors:

Yi Wu - Irvine CA, US
Cole S. Franklin - San Clemente CA, US
Brian Fraser - Los Angeles CA, US
Thomas Nicolosi - Mission Viejo CA, US

Assignee:

Akrion Technologies, Inc. - Wilmington DE

International Classification:

B08B 6/00

US Classification:

134 13, 134 1, 134 31, 134 34, 134 42, 438906, 310311, 31031601, 310317

Abstract:

A wafer cleaning method and system including a combined high frequency signal, a low frequency signal, and in one embodiment a biased voltage signal, allows cleaning particles and impurities off of fine-structured wafers, through application of an acoustic field to the wafer through a cleaning liquid which fosters micro-bubble formation for effective cleaning while buffering micro-bubble growth which would otherwise damage the wafer.

US Patent:

7156111, Jan 2, 2007

Filed:

Jun 10, 2004

Appl. No.:

10/864929

Inventors:

Cole S. Franklin - San Clemente CA, US
Yi Wu - Irvine CA, US
Brian Fraser - Los Angeles CA, US

Assignee:

Akrion Technologies, Inc - Wilmington

International Classification:

B08B 3/00

US Classification:

134 13, 134 1, 134 34, 134 42, 438906

Abstract:

A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. In another aspect, the invention is a system for carrying out the method. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.

US Patent:

D582797, Dec 16, 2008

Filed:

Sep 15, 2008

Appl. No.:

29/324525

Inventors:

Brian Fraser - Atlanta GA, US
Ty Hagler - Durham NC, US
Hayden Williams - Austell GA, US
Hua Li - Roswell GA, US

Assignee:

Home Depot USA, Inc. - Atlanta GA

International Classification:

1003

US Classification:

D10 40

US Patent:

7578302, Aug 25, 2009

Filed:

Nov 9, 2006

Appl. No.:

11/595029

Inventors:

Cole S. Franklin - San Clemente CA, US
Yi Wu - Irvine CA, US
Brian Fraser - Los Angeles CA, US

International Classification:

B08B 3/00

US Classification:

134 13, 134 1, 134 34, 134 42, 438906

Abstract:

A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.

US Patent:

20060260641, Nov 23, 2006

Filed:

Jul 18, 2006

Appl. No.:

11/489059

Inventors:

Yi Wu - Irvine CA, US
Cole Franklin - San Clemente CA, US
Brian Fraser - Los Angeles CA, US
Thomas Nicolosi - Mission Viejo CA, US

International Classification:

B08B 3/12

US Classification:

134001000

Abstract:

An acoustic energy cleaning system and method which fosters micro-bubble formation for effective cleaning while buffering micro-bubble growth which would otherwise damage the wafer. In one embodiment, the invention includes combining a first frequency signal and a second frequency signal having a positive amplitude bias component so as to form a combined signal. The combined signal, which has a positive amplitude offset, is applied to a transducer system that converts the combined signal into acoustic waves. The acoustic waves can be applied to the object to be cleaned in a cleaning fluid.