Brian Zachary Hayden

US Patent:

57838674, Jul 21, 1998

Filed:

Nov 6, 1995

Appl. No.:

8/554181

Inventors:

Robert Edward Belke - W. Bloomfield MI
Bethany Walles - Birmingham MI
Michael G. Todd - South Lyon MI
Brian J. Hayden - Royal Oak MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

H01L 2348
H01L 2352
H01L 2740

US Classification:

257783

Abstract:

In a method for reversible assembly of a semiconductor electronic flip-chip device to an electrical interconnecting substrate, a filled thermoplastic adhesive is interposed between an active face of the flip-chip device and a bond site on the substrate. Electrical connection is established between the flip-chip device and the substrate and, generally simultaneously, adhesive bonding between them is established via viscous flow of the filled thermoplastic adhesive above its glass transition temperature, followed by cooling of the adhesive. The adhesive can be reheated to free the flip-chip device of its adhesive bond to the substrate. The filled thermoplastic adhesive includes a low expansion filler in a binder matrix. In accordance with one aspect of the invention, the binder matrix is poly(aryl ether ketone) having the chemical formula ##STR1## where n is from 5 to 150 and R is selected from suitable divalent moieties. The filled thermoplastic adhesive can be interposed between the flip-chip device and the substrate as a preform or by other suitable method, such as syringe extrusion in a molten or viscous state.

US Patent:

55107214, Apr 23, 1996

Filed:

Dec 19, 1994

Appl. No.:

8/358297

Inventors:

Bethany J. Walles - Birmingham MI
Cuong V. Pham - Northville MI
Lawrence L. Kneisel - Novi MI
Brian J. Hayden - Royal Oak MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

G01R 1073

US Classification:

324754

Abstract:

A test apparatus for testing a know-good die integrated circuit is disclosed. The test apparatus uses conductive straps extending across trenches. The straps align with bond pads on the integrated circuit. When the bond pads are brought into contact with the straps, the straps exert a counterforce in the opposite direction to ensure a good electrical contact while testing the integrated circuit.

US Patent:

60192712, Feb 1, 2000

Filed:

Jul 11, 1997

Appl. No.:

8/893714

Inventors:

Brian John Hayden - Royal Oak MI
Cuong Van Pham - Northville MI
Rosa Lynda Nuno - Canton MI
Mark Stephen Topping - Lincoln Park MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

B23K 106
B23K 3102
B32B 3116
H05K 116

US Classification:

2281101

Abstract:

A method for bonding together at least two conductive members 20, wherein each member includes at least one metallic 22 having a respective bonding area 24. At least one member has a deposition of metallic bonding material 26 attached to each respective conductor proximate each bonding area, and at least one member has a plastic element 28 attached thereto proximate each respective bonding area. The members 20 are positioned in a predetermined orientation, clamped together between an ultrasonic horn and anvil arrangement, with pressure and orthogonal ultrasonic energy being applied thereto so that each plastic element 28 is heated, which in turn melts the bonding material 26. Any plastic element material between the conductors is squeezed away therefrom and the respective conductors 22 are brought into proximity with each other so that a molten joint of bonding material physically contacts each respective conductor. The members are then held together until each joint solidifies, and then the horn and/or anvil are retracted.

US Patent:

6326241, Dec 4, 2001

Filed:

Dec 29, 1997

Appl. No.:

8/999153

Inventors:

Robert Edward Belke - W. Bloomfield MI
Brian John Hayden - Royal Oak MI
Cuong Van Pham - Northville MI
Rosa Lynda Nuno - Canton MI
Michael George Todd - South Lyon MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

H01L 2144

US Classification:

438118

Abstract:

A solderless method for assembling a semiconductor electronic flip-chip device to an electrical interconnecting substrate including the steps of forming a plurality of raised electrical contacts and plurality of contact pads. The pads correspond in number and physical location with the electrical contacts. The pads and contact mate when brought together. A quantity of plastic material is interposed between the electrical device and substrate. The plastic material is heated so that it softens and flows. The electronic device and substrate are urged together. The urging step displaces the molten plastic material from between the contacts and pads. The contacts and pads are jointed directly without any adhesive, solder or conducive filler therebetween to electrically interconnect the electronic device and substrate. The plastic material is allowed to cool whereby the electronic device and substrate are adhesively bonded together and electrically interconnected.

US Patent:

57328730, Mar 31, 1998

Filed:

Jun 13, 1996

Appl. No.:

8/663574

Inventors:

Mark S. Topping - Lincoln Park MI
Cuong V. Pham - Northville MI
Brian J. Hayden - Royal Oak MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

B23K 2010

US Classification:

228 11

Abstract:

An ultrasonic wirebonder has a horn and a transducer for vibrating the horn at a predetermined frequency. A magnet affixed to the horn generates a magnetic field. A coil coupled to the magnet has an output signal induced from the magnetic field moving relative to said coil. A filtering means filters the output signal from the coil to determine the reliably of the ultrasonic bond. An output device is used to monitor the output signal and determine whether the bond is reliable.

US Patent:

59214600, Jul 13, 1999

Filed:

Jun 5, 1997

Appl. No.:

8/870049

Inventors:

Mark Stephen Topping - Lincoln Park MI
Cuong Van Pham - Northville MI
Brian John Hayden - Royal Oak MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

H05K 334
H01L 21607

US Classification:

2281115

Abstract:

A method of soldering materials by controlling ultrasonic energy to effect melting of only the solder in an assembly to be joined that is carried on a low temperature melting substrate. The method facilitates making electrical connections for completing an electronic circuit unit that is supported on a low temperature melting substrate and comprises (a) positioning together first and second conductive terminals for said circuit with a solder deposit therebetween to form an assembly, at least one of the terminals of such assembly being supported directly on such low temperature melting substrate; (b) gripping the assembly between an ultrasonic motion generating horn and an anvil, while exciting the horn to apply ultrasonic vibration to the first terminal to provide sufficient shearing energy that frictionally rubs at least one surface of the solder deposit in a rubbing direction generally parallel to said one surface to rapidly heat and melt the solder deposit; and (c) essentially immediately upon the completion melting of the solder deposit, ceasing the application of ultrasonic shearing energy to allow the solder to solidify and form a soldered diffusion joint between the terminals.

US Patent:

20200298761, Sep 24, 2020

Filed:

Mar 20, 2020

Appl. No.:

16/825495

Inventors:

- Van Buren Township MI, US
Brian John Hayden - Royal Oak MI, US

Assignee:

Visteon Global Technologies, Inc. - Van Buren Township MI

International Classification:

B60R 1/08
G02F 1/01
G02B 27/28
G02F 1/137
B60R 1/04
B60R 1/12

Abstract:

An electronic display system includes a display disposed in a housing. An electronic lens assembly is disposed in the housing proximate to and cooperating with the display. The electronic lens assembly includes one or more layers including a mirror element layer, a reflective polarizer layer cooperating with the mirror element layer, a rotator cell layer cooperating with the reflective polarizer layer, and a linear polarizer layer cooperating with the rotator cell layer and disposed opposite the reflective polarizer layer. A controller cooperates with the display and the electronic lens assembly and is configured to adjust the rotator cell layer of the electronic lens assembly between a reflective state in a first mode and a semi-transparent display state in a second mode.

US Patent:

20190202361, Jul 4, 2019

Filed:

Dec 28, 2018

Appl. No.:

16/235215

Inventors:

- Van Buren Township MI, US
Brian John Hayden - Royal Oak MI, US
Douglas Allen Pfau - Canton MI, US

Assignee:

Visteon Global Technologies, Inc. - Van Buren Township MI

International Classification:

B60R 1/12
B60K 35/00
B60R 1/04

Abstract:

A rear display system includes a display device disposed in a housing to generate an image on a projection surface. A mirror element is disposed proximate the display device and a lens is disposed proximate the mirror element. A tilt mechanism for adjustably positioning the mirror element relative to the display device between a first position and at least one second position includes a mounting assembly having at least one arm receiving and engaging one or more portions of the mirror element, a biasing element positioned between the mirror element and the mounting assembly and an adjustment apparatus having an indexing device configured to adjustably position the mirror element between the first position and the at least one second position relative to the display device.