Brian Keith Hayden

US Patent:

61264598, Oct 3, 2000

Filed:

Mar 24, 1997

Appl. No.:

8/822535

Inventors:

Prathap Amerwai Reddy - Farmington Hills MI
Cuong Van Pham - Northville MI
Brian John Hayden - Royal Oak MI
Daniel Edward Farnstrom - Redford MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

H01R 909

US Classification:

439 77

Abstract:

A substrate and electrical connector assembly including a unitary panel structure with metal conductors having a rigid main body portion, a rigid marginal edge portion, and a thin flexible section extending between the rigid main body portion and the rigid marginal edge portion. The assembly also includes an at least one conductive lead deposited on a surface of the plastic panel structure which extends from the rigid main body portion across the flexible section to the rigid marginal edge portion. Further included is an at least one conductive terminal affixed to the rigid marginal edge portion which is in electrical connection with the at least one conductive lead. The at least one conductive terminal is adapted to receive a mating connector. The flexible section enables the rigid marginal edge portion to move relative to the rigid main body portion.

US Patent:

54273013, Jun 27, 1995

Filed:

May 6, 1994

Appl. No.:

8/239106

Inventors:

Cuong V. Pham - Livonia MI
Brian J. Hayden - Royal Oak MI
Bethany J. Walles - Birmingham MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

H01L 21607

US Classification:

2281101

Abstract:

A process for bonding a flip chip (20) to a substrate (22) comprising positioning the flip chip (20) above the substrate (22). The flip chip (20) has an active face provided with conductive bumps so that its active face is oriented toward the substrate (22). The flip chip (20) is placed on the substrate (22) so that the bumps align with a bonding pattern on the substrate (22). An ultrasonic horn (30) is lowered having a flat surface onto a back side of the flip chip (20). Force is applied through the ultrasonic horn (30) to the back side of the flip chip (20), which is normal to the substrate (22) so that minimal lateral displacement of the flip chip (20) and the substrate (22) results. The ultrasonic horn (30) is then activated while the force is applied so that the ultrasonic energy is isothermally transferred across the flip chip (20) to the substrate (22) and a diffusion bond is created therebetween.

US Patent:

52750582, Jan 4, 1994

Filed:

Oct 30, 1992

Appl. No.:

7/968938

Inventors:

Cuong V. Pham - Livonia MI
Brian J. Hayden - Royal Oak MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

G01N 308

US Classification:

73827

Abstract:

Provided is a method and apparatus for electrically detecting the location of bond failure and wire breakage occurring during tensile strength testing of a wire sample having first and second bond foots affixed to respective first and second support pads. The method and apparatus monitors the voltage levels of first and second electrically conductive probes. The first probe has a primary lead in electrical contact with the first support pad and a secondary lead in electrical contact with the first bond foot. Similarly, the second electrically conductive probe has a primary lead in electrical contact with the second support pad and a secondary lead in electrical contact with the second bond foot. Voltage detection circuitry is provided in electrical contact with the first and second probes for detecting the voltage level at each of the respective primary and secondary leads to generate the respective corresponding output signals. Comparator circuitry is further provided in electrical contact with the voltage detection circuitry for receiving and comparing each of the output signals to a selected reference value and generating a supplemental output signal indicating the location of bond failure or wire breakage.

US Patent:

56695454, Sep 23, 1997

Filed:

Nov 4, 1996

Appl. No.:

8/743580

Inventors:

C. V. Pham - Northville MI
Brian J. Hayden - Royal Oak MI
Bethany J. Walles - Birmingham MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

B23K 2010
H01C 21607

US Classification:

228 11

Abstract:

A process for bonding a flip chip (20), of the type having an active face provided with conductive bumps, to a substrate (22) so that its active face is oriented toward the substrate (22). The flip chip (20) is coupled through a vacuum to the distended end (32) of an ultrasonic horn (30) and then lowered onto the substrate (22) so that the bumps (20b) align with a bonding pattern on the substrate (22). A bias force is applied through the ultrasonic horn (30) to the backside of the flip chip (20), in a direction normal to the substrate (22) so that minimal lateral displacement of the flip chip (20) and the substrate (22) results. The ultrasonic horn (30) is then activated while the bias force is applied such that the ultrasonic energy is isothermally transferred in a direction normal to and across the flip chip (20) to the substrate (22) for creating a diffusion bond therebetween.

US Patent:

55980961, Jan 28, 1997

Filed:

Dec 2, 1994

Appl. No.:

8/348432

Inventors:

Cuong V. Pham - Northville MI
Brian J. Hayden - Royal Oak MI
Bethany J. Walles - Birmingham MI
Peter R. Cibirka - Dearborn MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

G01R 3102

US Classification:

3241581

Abstract:

An apparatus for testing an integrated circuit includes a bond substrate having a location for an integrated circuit. The location on the bond substrate has a plurality of traces around each location. A first fixture holds the bond substrate in a fixed relation to first fixture and holds the integrated circuit in a fixed relation to the first fixture and the bond substrate. A wirebonder forms wirebonds between the traces and the bond pads. An electrical tester provides electrical signals from the traces to the bond pads to verifying the operation of the integrated circuit. A second fixture lifts the bond substrate while the integrated circuit remains held to the first fixture. A vibrator vibrates the first fixture in relation to the second fixture so that the wirebonds are broken at a predetermined location near the bond pad.

US Patent:

20190353946, Nov 21, 2019

Filed:

Dec 18, 2018

Appl. No.:

16/224195

Inventors:

- Van Buren Township MI, US
Qais Sharif - Northville MI, US
Brian Hayden - Royal Oak MI, US
Elijah Louis Auger - Farmington Hills MI, US

International Classification:

G02F 1/133
B60R 1/00
B60R 1/08
G02F 1/137
G02F 1/1335
G02F 1/13363
G02F 1/01
B60K 35/00

Abstract:

An electro-optical system includes a voltage supply device, an active polarizing layer, a retarding layer, and a reflective layer. The active polarizing layer is electrically coupled to the voltage supply device. The active polarizing layer is configured to switch back and forth between a non-polarized state and a polarized state as the voltage supply device supplies varying levels of voltage. The retarding layer is configured to alter the polarization state of light traveling through it. The reflective layer is positioned adjacent to the retarding layer.

US Patent:

20180357505, Dec 13, 2018

Filed:

Jun 8, 2017

Appl. No.:

15/617590

Inventors:

Paul Fredrick Luther Weindorf - Novi MI, US
Brian John Hayden - Royal Oak MI, US
Kong Pheng Lor - Warren MI, US

International Classification:

G06K 9/46
G06K 9/62
G06T 7/70
G06K 9/00
H04N 5/225
H04N 5/247
H04N 5/33
G02F 1/01
G02B 5/30
G02F 1/139
G02B 27/01

Abstract:

Disclosed herein are systems, methods, and devices for detecting a polarization of eyewear worn by a viewer gazing at an electronic display. The detection disclosed herein may be employed to control and adjust the electronic display to compensate for the effects of polarization. The systems disclosed herein incorporate an embodiment with two IR sources, and an embodiment employing a single IR source coupled with electro-optical devices.