Brian M Mcdermott

US Patent:

8581105, Nov 12, 2013

Filed:

Oct 1, 2012

Appl. No.:

13/632742

Inventors:

Brian J. McDermott - Fountain Hills AZ, US
Daniel McGowan - Casselberry FL, US
Sid Tryzbiak - Winter Springs FL, US

International Classification:

H05K 1/03

US Classification:

174255

Abstract:

A process of making an article of manufacture, the process including constructing an electrical device which implements circuitry having a portion in cavities, the portion defined by an epoxy dielectric material delivered with solid content sufficient that etching the epoxy forms cavities located in, and underneath an initial surface of, the dielectric material, sufficient that the etching of the epoxy uses non-homogeneity with the solid content in bringing about formation of the cavities and sufficient that the etching of the epoxy is such that a plurality of the cavities have a cross-sectional width that is greater than a maximum depth with respect to the initial surface, wherein the etching forms the cavities, and a conductive material, a portion of the conductive material in the cavities thereby forming teeth in the cavities, such that the conductive material forms the portion of the circuitry of the electrical device.

US Patent:

20140091053, Apr 3, 2014

Filed:

Oct 8, 2013

Appl. No.:

14/048592

Inventors:

Brian J. McDermott - Fountain Hills AZ, US
Daniel McGowan - Casselberry FL, US
Sid Tryzbiak - Tulsa OK, US

International Classification:

H05K 3/38

US Classification:

216 18

Abstract:

A multilayer electrical device, such as a printed circuit board, having a tooth structure including a metal layer set in a dielectric. The device includes a base; a conductive layer adjacent to the base; a dielectric material adjacent to conductive layer; a tooth structure including a metal layer set in the dielectric material to join the dielectric material to the metal layer; and wherein the metal layer forms a portion of circuitry.