Brian Tracy Scott

US Patent:

6361343, Mar 26, 2002

Filed:

Sep 21, 1999

Appl. No.:

09/400024

Inventors:

George H. Daskalakis - Forest Grove OR
Brian A. Scott - El Dorado Hills CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01R 1362

US Classification:

439327, 439371

Abstract:

A circuit card retention mechanism having a base which is mounted around an electrical connecter of a mother board and has various embodiments of an extension piece for securing a circuit card to the electrical connecter of the mother board is presented. The base of the retention mechanism has a number of pointed bites which incline inwardly from the base and, working in opposition to one another, securely fasten the base to the electrical connecter of the mother board. A tie-wrap may be attached to the base and connected by a circuit card hook or a circuit card holder to the circuit card. Alternatively, a retainer clip with a snap lock which snaps onto the circuit card may be utilized.

US Patent:

6367263, Apr 9, 2002

Filed:

May 31, 2000

Appl. No.:

09/583802

Inventors:

Brian A. Scott - El Dorado Hills CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

F25B 900

US Classification:

62 6, 622592, 16510426, 16510427, 16510431

Abstract:

A heat pipe includes a flow diverter that separates the heat pipe into an evaporator chamber and a condenser chamber. Each of the evaporator chamber and the condenser chamber are coupled to a compressor with a one-way valve. The compressor receives vaporous working fluid from the evaporator chamber, compresses it, and pumps it to the condenser chamber at a higher pressure and temperature. Within the condenser chamber, the working fluid enter a wicking structure and travels around the flow diverter to the evaporator chamber. The compressor can be an acoustic compressor that includes an acoustic resonating chamber. An integrated circuit package can include the combination of the heat pipe and compressor to create a refrigeration cycle that removes heat from an integrated circuit.

US Patent:

7554808, Jun 30, 2009

Filed:

Jun 22, 2006

Appl. No.:

11/472927

Inventors:

Brian A. Scott - El Dorado Hills CA, US
Paul J. Gwin - Orangcvale CA, US
Ioan Sauciuc - Phoenix AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 7/20
F25B 21/02
F28F 7/00
H01L 23/34

US Classification:

361710, 361718, 62 32, 62 37, 165 802, 165 803, 174 161, 174 163, 257720, 257722

Abstract:

An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive unit in contact with the second surface of the solid-state heat pump. Also included may be a stop in contact with the thermally-conductive unit, disposed at least partially over the first end of a cavity defined by the thermally-conductive unit, and defining an opening, and a fastener passing through the cavity, in contact with the core, and to bias the core toward the stop.

US Patent:

20070144199, Jun 28, 2007

Filed:

Dec 28, 2005

Appl. No.:

11/321245

Inventors:

Brian Scott - El Dorado Hills CA, US

International Classification:

F28D 5/00
F25D 23/12

US Classification:

062304000, 062259200

Abstract:

A two-phase liquid vapor enclosure is described. The enclosure includes an atomizer to spray fluid onto a heat evaporator surface. Fluid flows through a nozzle which atomizes the fluid into very small droplets. These small droplets vaporize upon reaching the heated evaporator surface. Once the vapor condenses to liquid, the liquid travels within the enclosure to recirculate to the atomizer.