Brian T Webb

US Patent:

6376266, Apr 23, 2002

Filed:

Nov 6, 2000

Appl. No.:

09/706599

Inventors:

Kenneth Teik Kheong Low - Singapore, SG
Saat Shukri Embong - Kuala Terengganu, MY
Chee Hiong Chew - Negeri Sembilan, MY
Boon Huat Lim - Johor, MY
Aik Chong Tan - Johor Bahru, MY
Albert Laninga - Tempe AZ
Santhiragasen al sengram Pillay - Negeri Sembilan, MY
Michael John Seddon - Gilbert AZ
Brian Webb - Chandler AZ

Assignee:

Semiconductor Components Industries LLC - Phoenix AZ

International Classification:

H01L 2166

US Classification:

438 15, 438106

Abstract:

A semiconductor package ( ) with a die ( ) having die pads ( ) coupled to inner ends ( ) of interconnects ( ), the die ( ) and the interconnects ( ) are molded in mold compound ( ) with mounting surface ( ) and outer ends ( ) exposed. A semiconductor die has an interconnect surface opposite the mounting surface.

US Patent:

55902324, Dec 31, 1996

Filed:

Feb 16, 1995

Appl. No.:

8/390209

Inventors:

Robert M. Wentworth - Phoenix AZ
David Galloway - Tempe AZ
Garland D. Cotney - Tempe AZ
Brian A. Webb - Chandler AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G02B 600
G02B 636

US Classification:

385 92

Abstract:

An optical package including a housing defining a mounting area with leads formed in the housing each having a first end in the mounting area and a second end external to the housing. A semiconductor die with photonic devices thereon is mounted in the mounting area and electrically connected to the leads. The active light areas of the photonic devices is accessible through the mounting area. Optical fiber alignment structure is mounted in the mounting area for receiving optical fibers and aligning the optical fibers with the active light areas of the photonic devices.

US Patent:

54770840, Dec 19, 1995

Filed:

Jan 3, 1995

Appl. No.:

8/367628

Inventors:

Brian A. Webb - Chandler AZ
Robert M. Wentworth - Phoenix AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2504

US Classification:

257714

Abstract:

A method for manufacturing a liquid-containing microelectronic device package. The method includes steps of providing (32) a base (16) including a microelectronic device (22) and a seal area disposed peripherally about the base (16), providing (34) a lid (12) and providing (34) a sealant (14) disposed between the base (16) and lid (12). The method also includes steps of immersing (36) the base (16), sealant (14) and lid (12) in a liquid (24) having a temperature above a sealant activation temperature and maintaining (38) the base (16), sealant (14) and lid (12) in the liquid (24) for a time sufficient to allow the liquid (24) to enter between the base (16) and lid (12) and to heat and thereby activate the sealant (14). The method further includes removing (40) the base (16), lid (12) and sealant (14) from the liquid (24) to provide a sealed, liquid-containing microelectronic device package (10).

US Patent:

49034014, Feb 27, 1990

Filed:

Apr 3, 1989

Appl. No.:

7/331972

Inventors:

Brian A. Webb - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01R 4300

US Classification:

29827

Abstract:

A method of making a leadframe useful in packaging semiconductor devices eliminates silver bleed between adjacent leads of the leadframe. This is accomplished by leaving excess leadframe material along the edges of the leads prior to silver plating the flag area and the portion of the leads adjacent to the flag area. After the plating operation, this excess leadframe material is removed thereby leaving silver free leads which will be exposed outside of a resulting encapsulated semiconductor package.

US Patent:

49948970, Feb 19, 1991

Filed:

Oct 26, 1989

Appl. No.:

7/427056

Inventors:

Theodore R. Golubic - Phoenix AZ
Frank E. Polka - Phoenix AZ
Brian A. Webb - Mesa AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2302

US Classification:

357 81

Abstract:

A single-in-line semiconductor package uses a multi-level heatsink having patterned conductors surrounding the semiconductor device. The patterned conductors are electrically isolated from the heatsink. Short bond wires are used to connect the semiconductor device to the patterned conductors. This arrangement eliminates the need for bonding shelves when bonding the leads and also increases the resistance of the bond wires from being swept away during encapsulation.

US Patent:

59637820, Oct 5, 1999

Filed:

Aug 1, 1997

Appl. No.:

8/904989

Inventors:

Brian A. Webb - Chandler AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2144
H01L 2148
H01L 2150
H01L 2166
G01R 3126

US Classification:

438 15

Abstract:

A semiconductor component can be manufactured by providing a leadframe (12) with leads (13) and a flag (14) substantially coplanar with at least one of the leads (13) wherein the flag (14) has a hole (15). An electronic substrate (11) is adhered to the flag (14) wherein a perimeter of the electronic substrate (11) has bonding pads (21), wherein the bonding pads (21) face toward the flag (14), wherein the electronic substrate (11) covers the hole (15), and wherein the flag (14) is absent over the bonding pads (21). Next, the pads (21) are wire bonded to the leads (13), and then the electronic substrate (11) and the leadframe (12) are encapsulated with a packaging material (17) wherein the packaging material (17) has an opening (23) and is devoid of covering the hole (15) in the flag (14).

US Patent:

54757789, Dec 12, 1995

Filed:

Oct 21, 1993

Appl. No.:

8/139181

Inventors:

Brian A. Webb - Chandler AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G02B 628
G02B 642
B29D 1100

US Classification:

385 31

Abstract:

A smart optical connector (100) sends and recieves optical signals over optical fibers (200, 202). The smart otical connector (100) is capable of converting electrical signals to optical signals for transmission, and capable of converting optical signals to electrical signals for reception. Addtionally, the smart optical connector (100) comprises circuitry (217) for modifying the format of the electrical signals-to provide compatibility between various equiptment (414, 416, 418) which require differing formats.

US Patent:

61718777, Jan 9, 2001

Filed:

Jun 17, 1998

Appl. No.:

9/099022

Inventors:

Brian A. Webb - Chandler AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2100
H01L 2144
H01L 2150

US Classification:

438 25

Abstract:

A package assembly (31) has a leadframe (10) including a locating flange (30), an optical transmitter (22) such as a laser diode mounted to the leadframe, and a package (32) enclosing both the optical transmitter and a portion of the leadframe so that the locating flange of the leadframe is disposed outside of the package. The locating flange is used as a reference datum to align the optical transmitter's relative height and lateral position during manufacture. Also, the locating flange is used as a reference datum in mating the package assembly to other, standard optical components when mounting to other components in an optical end product.