John A. Fitzsimmons - Poughkeepsie NY Janos Havas - Hopewell Junction NY Margaret J. Lawson - Newburgh NY Edward J. Leonard - Fishkill NY Bryan N. Rhoads - Pine Bush NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 21283
US Classification:
437187
Abstract:
A method of forming patterned films on a semiconductor substrate 10 includes the steps of depositing a hardened photo resist underlay 30 onto the substrate, then depositing a polyether sulfone release layer 32, then depositing a photo sensitive resist layer 34 and exposing an etching a metallization pattern 36, 38 to the substrate 10. The structure is then blanket deposited with a conductive layer 40 to thereby create a conductive contact stud 42. The film layer 40 and resist layer 34 are removed by dissolving the polyether sulfone layer 32 in an NMP solution and the photo resist underlayer 30 is then removed using a selective photo resist stripper composition.
Donald John Delehanty - Wappingers Falls NY Rangarajan Jagannathan - South Burlington VT Kenneth John McCullough - Fishkill NY Donna Diane Miura - Hopewell Junction NY George F. Ouimet - Millbrook NY David Lee Rath - Stromville NY Bryan Newton Rhoads - Pine Bush NY Frank John Schmidt - Highland Falls NY
Assignee:
International Business Machines Coporation - Armonk NY
International Classification:
C23F 110
US Classification:
438748
Abstract:
An aqueous etchant composition containing about 0. 01 to about 15 percent by weight of sulfuric acid and about 0. 01 to about 20 percent by weight of hydrogen peroxide or about 1 to 30 ppm of ozone is effective in removing polymer residue from a substrate, and especially from an integrated circuit chip having aluminum lines thereon.
Robert J. Fleming - Hopewell Junction NY Margaret J. Lawson - Newburgh NY Edward J. Leonard - Fishkill NY Bryan N. Rhoads - Pine Bush NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2100
US Classification:
156629
Abstract:
A method of forming patterned film onto a substrate includes the steps of: depositing a polyether sulfone release layer 50; depositing a photoresist underlayer 52; patterning a predetermined film pattern through the underlayer 52 and the polyether sulfone layer 50; depositing a film layer 60 onto the wafer, thereby forming a patterned film 62 on the substrate 10; weakening the mechanical bonding strength to the polyether sulfone release layer 50 by immersing it in NMP; stripping off layers 54 and 60 by applying an adhesive backed tape 64 to the top of the film layer and applying a pulling force; and, removing the polyether sulfone release layer 50 by immersing the wafer in a NMP bath.