Burgess R Johnson

US Patent:

6373188, Apr 16, 2002

Filed:

Dec 22, 1998

Appl. No.:

09/218816

Inventors:

Burgess R. Johnson - Bloomington MN
Wei Yang - Minnetonka MN

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H05B 3312

US Classification:

313506, 313502, 313500, 257 94

Abstract:

A more efficient solid-state light emitting device in which phosphors excited by radiation produce visible light. The efficiency is increased by, for example, providing a reflector adjacent to the phosphor layer for reflecting at least some of the radiation that passes through the phosphor, back into the phosphor. The reflector may also reflect at least some of the visible light that is emitted by the phosphor toward a designated light output. Alternatively, or in addition to, the lateral edges of the active region of the radiation source can be at least partially surrounded by a visible light emitting phosphor and a reflector. This allows more of the radiation to interact, and thus excite, the phosphor material, making the device more efficient. The reflector also may reduce optical and radiation cross talk between adjacent light emitting devices.

US Patent:

6397793, Jun 4, 2002

Filed:

Feb 13, 2001

Appl. No.:

09/782099

Inventors:

Wei Yang - Minnetonka MN
Ulrich Bonne - Hopkins MN
Burgess R. Johnson - Minneapolis MN

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

F02B 7100

US Classification:

123 46E

Abstract:

A knocking-based, micro-combustion engine constructed in three layers of micromachined material. Two outer layers contain means for directing gases and fuels into and out of vents in a middle layer. The middle layer has machined in it two, linear, free pistons with or without integral air springs, and vents for directing gases and fuels into and out of a combustion chamber. A high compression ratio is achieved. The engine can be constructed with means to generate electrical energy.

US Patent:

6445271, Sep 3, 2002

Filed:

Jun 29, 1999

Appl. No.:

09/342087

Inventors:

Burgess R. Johnson - Minneapolis MN

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H01F 500

US Classification:

336200, 336232, 257531

Abstract:

A three-dimensional micro-coil situated in a planar substrate. Two wafers have metal strips formed in them, and the wafers are bonded together. The metal strips are connected in such a fashion to form a coil and are encompassed within the wafers. Also, metal sheets are formed on the facing surfaces of the wafers to result in a capacitor. The coil may be a single or multi-turn configuration. It also may have a toroidal design with a core volume created by etching a trench in one of the wafers before the metal strips for the coil are formed on the wafer. The capacitor can be interconnected with the coil to form a resonant circuit. An external circuit for impedance measurement, among other things, and a processor may be connected to the micro-coil chip.

US Patent:

6487864, Dec 3, 2002

Filed:

Apr 23, 2002

Appl. No.:

10/127976

Inventors:

William P. Platt - Columbia Heights MN
Burgess R. Johnson - Bloomington MN

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

F25B 2102

US Classification:

62 32, 62 511

Abstract:

A cryogenic inertial Micro-Electro-Mechanical System (MEMS) device is provided. The device may include a vibratory gyroscope operable to sense a rotational acceleration. The device may also include a pre-amplifier co-located in a close proximity to the vibratory gyroscope. The device may be operated at substantially low temperatures, such as cryogenic temperatures, to reduce electrical noise and improve stability of outputs of the system.

US Patent:

6495865, Dec 17, 2002

Filed:

Feb 1, 2001

Appl. No.:

09/775098

Inventors:

Burgess R. Johnson - Bloomington MN
Barrett E. Cole - Bloomington MN
Robert D. Horning - Savage MN
Ulrich Bonne - Hopkins MN

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H01L 2974

US Classification:

257164, 257166, 438 20

Abstract:

A microcathode which integrates both an electron emitter, or cathode, and an extractor electrode. The electron emitter is attached to the back side of a thin film microstructure on a first surface of a substrate. Electrons are emitted from the electron emitter and into a via extending through the substrate. An electron beam is formed which is pulled through the via and out of the microcathode by an extractor electrode on a second surface of the substrate. The extractor electrode modulates the electron beam current, defines the beam profile, and accelerates the electrons toward an anode located outside of the microcathode. Microcathode of this invention are particularly suitable as electron emitting devices useful for various types of electron beam utilizing equipment such as flat cathode ray tube displays, microelectronic vacuum tube amplifiers, electron beam exposure devices and the like.

US Patent:

6498557, Dec 24, 2002

Filed:

Apr 19, 2001

Appl. No.:

09/838629

Inventors:

Burgess R. Johnson - Minneapolis MN

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H01F 500

US Classification:

336200, 336 65, 336 83

Abstract:

A three-dimensional micro-coil situated in a planar substrate. Two wafers have metal strips formed in them, and the wafers are bonded together. The metal strips are connected in such a fashion to form a coil and are encompassed within the wafers. Also, metal sheets are formed on the facing surfaces of the wafers to result in a capacitor. The coil may be a single or multi-turn configuration. It also may have a toroidal design with a core volume created by etching a trench in one of the wafers before the metal strips for the coil are formed on the wafer. The capacitor can be interconnected with the coil to form a resonant circuit An external circuit for impedance measurement, among other things, and a processor may be connected to the micro-coil chip.

US Patent:

6646364, Nov 11, 2003

Filed:

Jul 11, 2000

Appl. No.:

09/613489

Inventors:

Robert Horning - Savage MN
Burgess Johnson - Minneapolis MN

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H02N 100

US Classification:

310309

Abstract:

A microactuator device is disclosed that includes a plurality of generally parallel thin flexible sheets bonded together in a predetermined pattern to form an array of unit cells. Preferably, each of the sheets has only a single electrode layer located on one side of the sheet. Pairs of such sheets are then bonded together at spaced bonding locations with the electrode layers facing one another. Several sets of such sheet pairs can then be bonded together to form a microactuator device.

US Patent:

6684469, Feb 3, 2004

Filed:

Feb 15, 2002

Appl. No.:

10/077495

Inventors:

Robert Horning - Savage MN
Burgess Johnson - Minneapolis MN

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H04R 1700

US Classification:

29 2535, 29594, 29831, 29841, 29846, 156210

Abstract:

A method of manufacturing a microactuator device includes a plurality of generally parallel thin flexible sheets bonded together in a predetermined pattern to form an array of unit cells. Preferably, each of the sheets has only a single electrode layer located on one side of the sheet. Pairs of such sheets are then bonded together at spaced bonding locations with the electrode layers facing one another. Several sets of such sheet pairs can then be bonded together to form a microactuator device.