Carolyn M Stewart

US Patent:

20040102572, May 27, 2004

Filed:

Aug 25, 2003

Appl. No.:

10/380830

Inventors:

Katsuyoshi Kubo - Rye NY, US
Takahide Otsuka - Yardley PA, US
Masahiko Oka - Mahwah NJ, US
Tsuyoshi Miyamori - Settsu-shi, JP
Charles Stewart - Newark DE, US
Carolyn Stewart - Newark DE, US

International Classification:

C08J005/00
C08L077/00

US Classification:

525/055000, 264/331140, 525/132000, 525/178000

Abstract:

The present invention is a resin composition prepared by formulating an engineering plastic with a fluorine-containing polymer wherein said fluorine-containing polymer accounts for 0.005 to 1 mass % of the total of a mass of said engineering plastic and a mass of said fluorine-containing polymer, wherein said fluorine-containing polymer is a perfluoropolymer, and wherein said resin composition is used for extrusion molding or injection molding.

US Patent:

20040242771, Dec 2, 2004

Filed:

Aug 20, 2003

Appl. No.:

10/380825

Inventors:

Katsuyoshi Kubo - Rye NY, US
Takahide Otsuka - Yardley PA, US
Masahiko Oka - Mahwah NJ, US
Tsuyoshi Miyamori - Settsu-shi, JP
Charles Stewart - Newark DE, US
Carolyn Stewart - Newark DE, US

International Classification:

C08J005/00
C08L077/00

US Classification:

525/055000, 264/331140, 525/154000

Abstract:

The present invention is a low-temperature-decomposable engineering plastic resin composition prepared by formulating a low-temperature-decomposable engineering plastic with a fluorine-containing resin, wherein said low-temperature-decomposable engineering plastic has a melting point of not higher than 200 C. and a decomposition temperature of not higher than 300 C., and wherein said fluorine-containing resin is a resin comprising a fluorine-containing polymer, said fluorine-containing polymer having a fluorine atom and at least one atom species selected from the group consisting of hydrogen atom, chlorine atom, bromine atom and iodine atom, said fluorine atom and said at least one atom species being bound to a non-terminal carbon atom constituting a main chain, and said fluorine-containing polymer having substantially no polar functional groups reactive to the low-temperature-decomposable engineering plastic.

US Patent:

20030109646, Jun 12, 2003

Filed:

Nov 21, 2001

Appl. No.:

09/989160

Inventors:

Katsuyoshi Kubo - Rye NY, US
Takahide Otsuka - Yardley PA, US
Masahiko Oka - Mahwah NJ, US
Charles Stewart - Newark DE, US
Carolyn Stewart - Newark DE, US

Assignee:

DAIKIN INSTITUTE OF ADVANCED CHEMISTRY AND TECHNOLOGY

International Classification:

C08L077/00

US Classification:

525/420000

Abstract:

A resin composition prepared by formulating an engineering plastic with a fluorine-containing polymer in a mass ratio of the engineering plastic to the fluorine-containing polymer of from 99:1 to 99.995:0.005. Also disclosed is a method for producing a shaped article by melting and molding the resin composition.