Carrie W Low

US Patent:

20160362295, Dec 15, 2016

Filed:

Aug 24, 2016

Appl. No.:

15/246278

Inventors:

- Shanghai, CN
Jeremy R. Hui - San Jose CA, US
Carrie Wing-Zin Low - Union City CA, US
Mehrnaz Motiee - San Francisco CA, US

International Classification:

B81C 1/00
B81B 7/00

Abstract:

Methods and structures that may be implemented in one example to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) such as sensors and actuators. For example, structures having varying characteristics may be fabricated using the same basic process flow by selecting among different process options or modules for use with the basic process flow in order to create the desired structure/s. Various process flow sequences as well as a variety of device design structures may be advantageously enabled by the various disclosed process flow sequences.

US Patent:

20160023888, Jan 28, 2016

Filed:

Nov 4, 2014

Appl. No.:

14/532658

Inventors:

- Austin TX, US
Jeremy R. Hui - San Jose CA, US
Carrie Wing-Zin Low - Union City CA, US
Mehrnaz Motiee - San Francisco CA, US

International Classification:

B81B 7/00
B81C 1/00

Abstract:

Methods and structures that may be implemented in one example to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) such as sensors and actuators. For example, structures having varying characteristics may be fabricated using the same basic process flow by selecting among different process options or modules for use with the basic process flow in order to create the desired structure/s. Various process flow sequences as well as a variety of device design structures may be advantageously enabled by the various disclosed process flow sequences.

US Patent:

20160023889, Jan 28, 2016

Filed:

Nov 4, 2014

Appl. No.:

14/532675

Inventors:

- Austin TX, US
Jeremy R. Hui - San Jose CA, US
Carrie Wing-Zin Low - Union City CA, US

International Classification:

B81B 7/00
B81C 1/00
B81B 3/00

Abstract:

Membrane transducer structures and thin-film encapsulation methods for manufacturing the same are provided. In one example, the thin film encapsulation methods may be implemented to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) that include the membrane transducers.

US Patent:

20150008545, Jan 8, 2015

Filed:

Sep 24, 2014

Appl. No.:

14/494688

Inventors:

- Austin TX, US
Carrie W. Low - Union City CA, US
Jeremy Ryan Hui - Mountain View CA, US
Zhen Gu - Cupertino CA, US

International Classification:

B81B 3/00

US Classification:

257418

Abstract:

An apparatus is formed on a substrate including at least one semiconductor device. The apparatus includes a microelectromechanical system (MEMS) device comprising at least one of a portion of a first structural layer and a portion of a second structural layer formed above the first structural layer. The second structural layer has a thickness substantially greater than a thickness of the first structural layer. In at least one embodiment, the MEMS device includes a first portion of the second structural layer and a second portion of the second structural layer. In at least one embodiment, the MEMS device further comprises a gap between the first portion of the second structural layer and the second portion of the second structural layer. In at least one embodiment, the gap has a width at least one order of magnitude less than the thickness of the second structural layer.