Chad M Brick

US Patent:

20060083925, Apr 20, 2006

Filed:

Mar 2, 2005

Appl. No.:

11/070617

Inventors:

Richard Laine - Ann Arbor MI, US
Ryo Tamaki - Clifton Park NY, US
Jiwon Choi - Ann Arbor MI, US
Mark Roll - Ann Arbor MI, US
Chad Brick - Rose City MI, US
Michael Asuncion - Ann Arbor MI, US

International Classification:

B32B 27/06
C08G 77/04
C08L 83/04
B32B 9/00

US Classification:

428405000, 428403000, 528043000

Abstract:

Functionalized silsesquioxanes containing from 6 to 24 silicon atoms and minimally about 67 mol percent RSiOmoieties where R is a phenyl group bearing a chemically reactive functional group are highly suitable for use as nanoparticles in producing highly ordered nanocomposites of many types, containing a high proportion of interphase. The nanocomposites have unusual physicochemical properties due to the use of uniform, highly functionalized nanoparticles.

US Patent:

20060103029, May 18, 2006

Filed:

Oct 4, 2005

Appl. No.:

11/242741

Inventors:

Rafil Basheer - Rochester Hills MI, US
Richard Laine - Ann Arbor MI, US
Santy Sulaiman - Ypsilanti MI, US
Chad Brick - Ann Arbor MI, US
Christopher DeSana - Ann Arbor MI, US

International Classification:

H01L 23/48

US Classification:

257778000

Abstract:

A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that comprises a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) that is used as a curing agent for a tetrafunctional, low viscosity, and relatively rigid TGMX epoxy resin. An embodiment is also directed to the assembly of a flip chip package that uses the underfill mixture.

US Patent:

20110104614, May 5, 2011

Filed:

Jun 30, 2010

Appl. No.:

12/803602

Inventors:

Osamu Onishi - Tokyo, JP
Haruo Ikeda - Tokyo, JP
Larry Rhodes - Silver Lake OH, US
Paul Evans - Allston MA, US
Edmund Elce - Lakewood OH, US
Andrew Bell - Lakewood OH, US
Chad Brick - Broadview Hts OH, US
Hendra Ng - Highland Heights OH, US
Pramod Kandanarachchi - Brecksville OH, US

International Classification:

G03F 7/004
G03F 7/20

US Classification:

4302801, 4302701, 430311

Abstract:

Embodiments in accordance with the present invention encompass self-imageable film forming compositions that comprise norbornene-type polymers and that can be formulated to be either positive tone imaging or negative tone. The films formed thereby are useful in the forming of microelectronic and optoelectronics devices.

US Patent:

20180194880, Jul 12, 2018

Filed:

Jan 4, 2018

Appl. No.:

15/861801

Inventors:

- BRECKSVILLE OH, US
CHAD BRICK - BRECKSVILLE OH, US
DOUG SKILSKYJ - BRECKSVILLE OH, US

Assignee:

PROMERUS, LLC - BRECKSVILLE OH

International Classification:

C08F 32/08
C08L 45/00
C08F 2/46

Abstract:

Embodiments in accordance with the present invention encompass compositions encompassing a procatalyst and a thermal or photoactivator along with one or more monomers which undergo vinyl addition polymerization when said composition is heated to a temperature from 50 C. to 100 C. to form a substantially transparent film. The monomers employed therein have a range of refractive index from 1.4 to 1.6 and thus these compositions can be tailored to form transparent films of varied refractive indices. Accordingly, compositions of this invention are useful in various opto-electronic applications, including as coatings, encapsulants, fillers, leveling agents, among others.