Chad Eric Patterson

US Patent:

20210043542, Feb 11, 2021

Filed:

Mar 24, 2020

Appl. No.:

16/828933

Inventors:

- Waltham MA, US
Alberto F. Viscarra - Torrance CA, US
Michael M. Fitzgibbon - Playa Del Rey CA, US
Chad E. Patterson - Los Angeles CA, US
Kevin C. Rolston - Westchester CA, US
Duke Quach - San Gabriel CA, US
Kevin P. Agustin - Los Angeles CA, US

International Classification:

H01L 23/40
G06F 1/20
H05K 3/32
H05K 7/10
H05K 7/20

Abstract:

A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.