Chan M Desaigoudar

US Patent:

57888540, Aug 4, 1998

Filed:

Sep 26, 1994

Appl. No.:

8/312322

Inventors:

Chan M. Desaigoudar - Los Gatos CA
Suren Gupta - San Jose CA

Assignee:

California Micro Devices Corporation - Milpitas CA

International Classification:

B44C 122
H01L 2100

US Classification:

216 13

Abstract:

The fabrication of thin film inductors on a substrate, which may include thin film resistors, thin film capacitors, and semiconductor devices. In one embodiment an inductor is fabricated initially on a substrate and then integrated with other devices subsequently formed on the substrate. In this embodiment, process steps used to fabricate such other devices utilize temperatures sufficiently low to prevent damaging or destroying the characteristics of the inductor. In another embodiment the fabrication of an inductor is achieved through photoresist masking and plating techniques. In alternative embodiments, fabrication of an inductor is achieved by sputtering, photoresist processes and etching/ion-milling techniques. A combination of various individual process steps from various embodiments are suitable for use to fabricate the individual layers to achieve a structure of this invention. The inductor fabricated in accordance with this invention is connected to other passive or active components through metal interconnections in order to improve the frequency performance of the inductor.

US Patent:

54502632, Sep 12, 1995

Filed:

Jul 28, 1994

Appl. No.:

8/281925

Inventors:

Chan M. Desaigoudar - Los Gatos CA
Suren Gupta - San Jose CA

Assignee:

California Micro Devices, Inc. - Milpitas CA

International Classification:

G11B 5127

US Classification:

360110

Abstract:

The fabrication of thin film inductors on a substrate, which may include thin film resistors, thin film capacitors, and semiconductor devices. In one embodiment an inductor is fabricated initially on a substrate and then integrated with other devices subsequently formed on the substrate. In this embodiment, process steps used to fabricate such other devices utilize temperatures sufficiently low to prevent damaging or destroying the characteristics of the inductor. In another embodiment the fabrication of an inductor is achieved through photoresist masking and plating techniques. In alternative embodiments, fabrication of an inductor is achieved by sputtering, photoresist processes and etching/ion-milling techniques. A combination of various individual process steps from various embodiments are suitable for use to fabricate the individual layers to achieve a structure of this invention. The inductor fabricated in accordance with this invention is connected to other passive or active components through metal interconnections in order to improve the frequency performance of the inductor.

US Patent:

53707664, Dec 6, 1994

Filed:

Aug 16, 1993

Appl. No.:

8/107246

Inventors:

Chan M. Desaigoudar - Los Gatos CA
Suren Gupta - San Jose CA

Assignee:

California Micro Devices - Milpitas CA

International Classification:

B44C 122
C23F 100
C03C 1500

US Classification:

156643

Abstract:

The fabrication of thin film inductors on a substrate, which may include thin film resistors, thin film capacitors, and semiconductor devices. In one embodiment an inductor is fabricated initially on a substrate and then integrated with other devices subsequently formed on the substrate. In this embodiment, process steps used to fabricate such other devices utilize temperatures sufficiently low to prevent damaging or destroying the characteristics of the inductor. In another embodiment the fabrication of an inductor is achieved through photoresist masking and plating techniques. In alternative embodiments, fabrication of an inductor is achieved by sputtering, photoresist processes and etching/ion-milling techniques. A combination of various individual process steps from various embodiments are suitable for use to fabricate the individual layers to achieve a structure of this invention. The inductor fabricated in accordance with this invention is connected to other passive or active components through metal interconnections in order to improve the frequency performance of the inductor.