Charles Norman Elsbree

US Patent:

46065890, Aug 19, 1986

Filed:

Jan 12, 1984

Appl. No.:

6/570065

Inventors:

Charles N. Elsbree - Cupertino CA
Hector A. Regner - Newport Beach CA
Claude Rodriguez - Carlloton TX
Anthony Ravlich - Huntington Beach CA

Assignee:

H & V Services - Fountain Valley CA

International Classification:

H01R 424

US Classification:

339 17C

Abstract:

A compliant pin for preferable insertion into a multi-layer backpanel is disclosed. The pin includes a wire-wrap area, a pin stop, and a connector area. Between the connector area and the stop there is located the compliant area which forms the critical function of pin support and electrical connection. The compliant area includes first and second legs spreading out to define an eye from the pin stop adjacent the wire-wrap area of the pin. Similarly, the paired legs come together at a symmetrically defined eye adjacent the connector area. In between the eyes, along the compliant portions of the leg, are formed opposing offset wedges. The opposing offset wedges are defined by a stamping process which process does not deform the sheet of material out of which the pin is made from its original planar disposition. Looking at the pin in section, paired and offset wedges are formed at an approximate 45. degree. angle to the plane of the material from which the pin is formed.

US Patent:

45984719, Jul 8, 1986

Filed:

Jan 22, 1985

Appl. No.:

6/693697

Inventors:

Charles N. Elsbree - Cupertino CA
Werner Kuhne - Pagosa Springs CO

Assignee:

Symtron Corporation - Mountain View CA

International Classification:

H01R 914
B23P 2300

US Classification:

29845

Abstract:

The present invention is an improved machine for inserting a plurality of pins from a continuous webbing of pins into a motherboard. The machine has a pair of plier-like jaws with interior confronting surfaces for grasping and holding the pins when the jaws are closed. The two jaws, which extend downward, are separated from each other above the confronting surfaces to provide an opening through the jaws. The continuous webbing is fed through this opening with the pins extending down between the confronting surfaces of the jaws. When the desired number of pins are between the jaws, the jaws close to grasp the pins and the carrier strip is then separated from the pins. The jaws are then moved downward to insert the pins into the motherboard with the opening preventing interference with the carrier strip.

US Patent:

55884199, Dec 31, 1996

Filed:

Dec 16, 1994

Appl. No.:

8/357504

Inventors:

Charles N. Elsbree - Santa Rosa CA

Assignee:

Dynatex International - Santa Rosa CA

International Classification:

B28D 104

US Classification:

125 15

Abstract:

In a plating process for constructing a nickel embedded abrading particle saw blade on a saw blade substrate, the step of plating abrading particles onto and within the supporting copper substrate is disclosed. The beveled edge of a circular aluminum saw blade blank is first coated with a thin zinc layer. Thereafter, copper and abrading particles are plated followed by conventional abrading particle and nickel plating. Conventional material removal thereafter follows at the saw blade side adjacent the circular saw blade blank, saw blade edge, and copper layer. With removal of the copper layer, abrading particles originally partially embedded in the copper layer are exposed for cutting. The need for electro-polishing and garnating is eliminated in so far as exposure of abrading particles is concerned. The final saw blade product produced has uniform cutting edges on both sides with less likelihood of producing edge fractures, chips, or cracks in silicon wafers during separation.

US Patent:

57024928, Dec 30, 1997

Filed:

Jun 11, 1996

Appl. No.:

8/660587

Inventors:

Charles N. Elsbree - Santa Rosa CA

Assignee:

Dynatex International - Santa Rosa CA

International Classification:

B28D 104

US Classification:

51307

Abstract:

In a plating process for constructing a nickel/embedded abrading particle saw blade on a saw blade substrate, the step of plating abrading particles onto and within the supporting copper substrate is disclosed. The beveled edge of a circular aluminum saw blade blank is first coated with a thin zinc layer. Thereafter, copper and abrading particles are plated followed by conventional abrading particle and nickel plating. Conventional material removal thereafter follows at the saw blade side adjacent the circular saw blade blank, saw blade edge, and copper layer. With removal of the copper layer, abrading particles originally partially embedded in the copper layer are exposed for cutting. The need for electro-polishing and garnating is eliminated in so far as exposure of abrading particles is concerned. The final saw blade product produced has uniform cutting edges on both sides with less likelihood of producing edge fractures, chips, or cracks in silicon wafers during separation.