Charles J Gordon

US Patent:

56785470, Oct 21, 1997

Filed:

Apr 26, 1995

Appl. No.:

8/429138

Inventors:

Mark L. Faupel - Conyers GA
Charles Leonard Gordon - New York NY
John D. Stephens - Alpharetta GA
Seth D. Nathanson - Alpharetta GA
Kenneth E. Doe - Kent WA
Steven Erik Hagstrom - Bothell WA

Assignee:

Biofield Corp. - Roswell GA

International Classification:

A61B 505

US Classification:

1286531

Abstract:

A method and apparatus for screening or sensing disease states, injury sites or bodily conditions in a human or animal subject by separately detecting the DC biopotential of the electromagnetic field at a plurality of test points in a test area. The DC biopotentials are converted by analog to digital converters connected to DC biopotential test sensors at the test points into digital test signals, and the DC biopotential test sensors and analog to digital converters form a biopotential sensing section which is separate from a processing section that receives and processes the digital test signals. Signals between the processing section and the bopotential sensing section are transmitted by a transmission network which electrically isolates the two sections. The conversions performed by the analog to digital converters are synchronized with the AC line frequency of the apparatus power supply, and the digital test signals are filtered in the processing section by digital filters, each of which is dedicated to an individual DC biopotential test sensor.

US Patent:

20180047149, Feb 15, 2018

Filed:

Apr 26, 2017

Appl. No.:

15/497925

Inventors:

- Dallas TX, US
Brant William Paquette - Allen TX, US
Vince Christian Samek - Richmond VA, US
Michael Jay Jenson - Richardson TX, US
David Matthew Curran - Plano TX, US
Jon Evan Button - Dallas TX, US
Charles David Gordon - McKinney TX, US

International Classification:

G06T 7/00
G06T 7/70

Abstract:

A method of providing a semiconductor device and a computer-readable medium having instructions for performing the method are disclosed. The method includes receiving a first wafer defect map that defines comparison regions and identifies visual defect locations for a wafer. A format of the comparison regions is determined, with the format chosen from a group including die-to-die, partial-shot-to-partial-shot and full-shot-to-full-shot. If the comparison format is not die-to-die, mapping information is received that provides die locations within the comparison regions. A wafer layout map is provided that identifies die locations within the wafer.