Charles E Turner

US Patent:

6708400, Mar 23, 2004

Filed:

Oct 15, 2001

Appl. No.:

09/978341

Inventors:

Mark Kintis - Manhattan Beach CA
Charles G. Turner - La Habra Heights CA

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H05K 336

US Classification:

29830, 29825, 29834, 29835, 361752

Abstract:

Reflow soldering of a variety of circuit boards ( ) in a variety of sizes and shapes to assigned locations on the base or carrier ( ) of the electronic module housing ( ) is simplified by eliminating custom made metal blocks previously used to clamp the circuit boards against the carrier metal. Instead, the solder-backed circuit boards are placed in assigned positions in the module housing and the inside volume of that housing is filled ( ) with particulate, such as small beads ( ), covering the circuit boards, but leaving the edges of the upstanding metal shields ( and ) visible. A plate ( ) backed foam sheet ( ) is placed over the module housing ( ) and clamped down ( ), pressing against the beads. The clamped assembly is then heated ( ) to reflow the solder, soldering the circuit boards in place.

US Patent:

7162793, Jan 16, 2007

Filed:

Nov 7, 2003

Appl. No.:

10/703819

Inventors:

Mark Kintis - Manhattan Beach CA, US
Charles G. Turner - La Habra Heights CA, US

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

B23P 19/00

US Classification:

29757, 292811, 29825, 29830, 29831, 29834, 269266, 361752, 361760, 361797, 361800, 361801, 361802

Abstract:

Reflow soldering of a variety of circuit boards () in a variety of sizes and shapes to assigned locations on the base or carrier () of the electronic module housing () is simplified by eliminating custom made metal blocks previously used to clamp the circuit boards against the carrier metal. Instead, the solder-backed circuit boards are placed in assigned positions in the module housing and the inside volume of that housing is filled () with particulate, such as small beads (), covering the circuit boards, but leaving the edges of the upstanding metal shields ( and ) visible. A plate () backed foam sheet () is placed over the module housing () and clamped down (), pressing against the beads. The clamped assembly is then heated () to reflow the solder, soldering the circuit boards in place.

US Patent:

D2713071, Nov 8, 1983

Filed:

Mar 27, 1981

Appl. No.:

6/248051

Inventors:

John R. Green - Tarzana CA
Charles D. Turner - Rolling Hills CA

International Classification:

D1606

US Classification:

D16133

US Patent:

42681111, May 19, 1981

Filed:

Aug 27, 1979

Appl. No.:

6/070141

Inventors:

John R. Green - Compton CA
Charles D. Turner - Rolling Hills CA

International Classification:

G02B 2318

US Classification:

350 70

Abstract:

A low-cost folding binocular which may be collapsed to a relatively thin package. The foldable binocular includes a laminated synthetic plastic, pressed paper or cardboard case provided with synthetic plastic objective and eyepiece lenses. The focus adjustment is effected by longitudinal folding of the case along the same fold lines which permit the case to be collapsed. No gluing is necessary.