Chen Hao Sun

US Patent:

20220224433, Jul 14, 2022

Filed:

Jan 24, 2022

Appl. No.:

17/583185

Inventors:

- Santa Clara CA, US
Alexandra Wright - Oakland CA, US
Chen Sun - Berkeley CA, US
Mark Wade - Berkeley CA, US
Roy Edward Meade - Lafayette CA, US

International Classification:

H04J 14/02
H04Q 11/00
H04B 10/50

Abstract:

A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.

US Patent:

20220214497, Jul 7, 2022

Filed:

Mar 22, 2022

Appl. No.:

17/701072

Inventors:

- Santa Clara CA, US
Chen Sun - Berkeley CA, US
Shahab Ardalan - Santa Clara CA, US
John Fini - Albany CA, US
Forrest Sedgwick - Santa Clara CA, US

International Classification:

G02B 6/12
H01L 21/66
G02B 6/13
G01M 11/00

Abstract:

An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.

US Patent:

20230025441, Jan 26, 2023

Filed:

Jul 26, 2021

Appl. No.:

17/385692

Inventors:

- Hopkinton MA, US
Xu Jian - Shanghai, CN
Chen Sun - Seattle WA, US
YuChan Lo - Taoyuan Dist., TW

International Classification:

G06F 11/36

Abstract:

A system can identify a file comprising computer-executable instructions, wherein the file has been modified since the file was last transformed into a computer-executable program on which a group of tests was performed. The system can, for respective tests, determine respective line coverage ratios, respective function coverage ratios, and respective branch coverage ratios. The system can select an updated group of tests from the group of tests based on the respective line ratios, the respective function ratios, and the respective branch ratios, the updated group of tests comprising a subgroup of the group of tests. The system can create an updated computer-executable program from the file. The system can test the updated computer-executable program with the updated group of tests.

US Patent:

20210286129, Sep 16, 2021

Filed:

Feb 24, 2021

Appl. No.:

17/184537

Inventors:

- Santa Clara CA, US
Vladimir Stojanovic - Berkeley CA, US
Chen Sun - Berkeley CA, US
Derek van Orden - San Francisco CA, US
Mark Taylor Wade - Berkeley CA, US

International Classification:

G02B 6/12
G02B 6/293
H04B 10/25
G02B 6/125
G02B 6/43

Abstract:

An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

US Patent:

20210264203, Aug 26, 2021

Filed:

Nov 18, 2019

Appl. No.:

17/046313

Inventors:

- Mountain View CA, US
Aleksei Timofeev - Mountain View CA, US
Zhen Li - Sunnyvale CA, US
Chun-Ta Lu - Sunnyvale CA, US
Manan Shah - Los Altos CA, US
Chen Sun - San Francisco CA, US
Krishnamurthy Viswanathan - Sunnyvale CA, US
Chao Jia - Sunnyvale CA, US

International Classification:

G06K 9/62
G06K 9/46

Abstract:

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for realizing a multimodal image classifier. In an aspect, a method includes, for each image of a plurality of images: processing the image by a textual generator model to obtain a set of phrases that are descriptive of the content of the image, wherein each phrase is one or more terms, processing the set of phrases by a textual embedding model to obtain an embedding of predicted text for the image, and processing the image using an image embedding model to obtain an embedding of image pixels of the image. Then a multimodal image classifier is trained on the embeddings of predicted text for the images and the embeddings of image pixels for the images to produce, as output, labels of an output taxonomy to classify an image based on the image as input.

US Patent:

20210257021, Aug 19, 2021

Filed:

Feb 14, 2021

Appl. No.:

17/175678

Inventors:

- Santa Clara CA, US
Vladimir Stojanovic - Berkeley CA, US
Chen Sun - Berkeley CA, US
Mark Wade - Berkeley CA, US
Hugo Saleh - Tuscaloosa AL, US
Charles Wuischpard - Danville CA, US

International Classification:

G11C 11/42
G11C 5/04
G11C 5/06

Abstract:

A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.

US Patent:

20210258078, Aug 19, 2021

Filed:

Feb 14, 2021

Appl. No.:

17/175677

Inventors:

- Santa Clara CA, US
Vladimir Stojanovic - Berkeley CA, US
Chen Sun - Berkeley CA, US
Mark Wade - Berkeley CA, US
Hugo Saleh - Tuscaloosa AL, US
Charles Wuischpard - Danville CA, US

International Classification:

H04B 10/80
H04B 10/516

Abstract:

A remote memory system includes a substrate of a multi-chip package, an integrated circuit chip connected to the substrate, and an electro-optical chip connected to the substrate. The integrated circuit chip includes a high-bandwidth memory interface. An electrical interface of the electro-optical chip is electrically connected to the high-bandwidth memory interface. A photonic interface of the electro-optical chip is configured to optically connect with an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals received through the electrical interface from the high-bandwidth interface into outgoing optical data signals. The optical macro transmits the outgoing optical data signals through the photonic interface to the optical link. The optical macro also converts incoming optical data signals received through the photonic interface into incoming electrical data signals. The optical macro transmits the incoming electrical data signals through the electrical interface to the high-bandwidth memory interface.

US Patent:

20210150350, May 20, 2021

Filed:

Nov 16, 2020

Appl. No.:

17/099656

Inventors:

- Mountain View CA, US
Yi Shen - Sunnyvale CA, US
Hang Zhao - Sunnyvale CA, US
Chen Sun - San Francisco CA, US

International Classification:

G06N 3/08

Abstract:

Methods, systems, and apparatus, including computer programs encoded on computer storage media, for agent trajectory prediction using vectorized inputs.