Cheng E Lee

US Patent:

7683380, Mar 23, 2010

Filed:

Jul 13, 2007

Appl. No.:

11/777987

Inventors:

Cheng Tsin Lee - Richmond CA, US
Qinghong Du - Hercules CA, US
Jean-Yves Naulin - Richmond CA, US

Assignee:

Dicon Fiberoptics, Inc. - Richmond CA

International Classification:

H01L 27/15
H01L 29/26
H01L 31/12
H01L 33/00
H01L 29/22
H01L 29/227
H01L 29/06
H01L 31/0328
H01L 31/0336
H01L 31/072
H01L 31/109

US Classification:

257 79, 257 13, 257 98, 257 99, 257E25028, 257E25032, 257E33001, 257E33002

Abstract:

In one embodiment of an epitaxial LED device, a buffer layer (e. g. dielectric layer) between the current spreading layer and the substitute substrate includes a plurality of vias and has a refractive index that is below that of the current spreading layer. A reflective metal layer between the buffer layer and the substitute substrate is connected to the current spreading layer through the vias in the buffer layer. The buffer layer separates the current spreading layer from the reflective metal layer. In yet another embodiment, stress management is provided by causing or preserving stress, such as compressive stress, in the LED so that stress in the LED is reduced when it experiences thermal cycles. In one implementation of this embodiment, a layer is attached to the LED and reflective metal layer, and causes or preserves stress in the LED along one or more directions parallel to an interface between the LED epitaxial layers so that stress in the LED is reduced in said one or more directions when temperature of the structure is increased.

US Patent:

7919780, Apr 5, 2011

Filed:

Aug 5, 2008

Appl. No.:

12/186165

Inventors:

Cheng Tsin Lee - Richmond CA, US

Assignee:

DiCon Fiberoptics, Inc. - Richmond CA

International Classification:

H01L 29/26
H01L 31/00
H01L 29/18
H01L 33/00

US Classification:

257 79, 257 13, 257 88, 257 94, 257E33001, 257E33057

Abstract:

In one embodiment of the invention, a bonding material is used to bond a substitute substrate to the LED, wherein the bonding material does not including gold or tin. The bonding material preferably includes gallium (Ga), such as a combination of Ga and Al or Cu. This bonding material has high thermal conductivity, high strength, high temperature stability and is low cost. In another embodiment of the invention, the substitute substrate is first thinned before it is bonded to the LED structure, so that the substitute substrate is flexible and conforms to the shape of the LED structure. In yet another embodiment of the invention, an apparatus is used for bonding a substitute substrate to a LED which includes a plurality of semiconductor epitaxial layers, said semiconductor epitaxial layers having been grown on the growth substrate so that said semiconductor epitaxial layers are curved in shape. The apparatus includes a conduit for evacuating a region near the substitute substrate on a side of the substitute substrate that is opposite to that of said semiconductor epitaxial layers. Gas pressure is applied on the semiconductor epitaxial layers, and the substitute substrate conforms to the shape of said semiconductor epitaxial layers as a result of pressure applied.

US Patent:

20030127329, Jul 10, 2003

Filed:

Jun 1, 2002

Appl. No.:

10/159914

Inventors:

Donald DeVoe - Bethesda MD, US
Cheng Lee - Ellicott City MD, US

International Classification:

G01N027/26
G01N027/447

US Classification:

204/454000, 204/451000, 204/601000

Abstract:

One embodiment of the invention relates to a microfluidic apparatus for controlling fluid flow velocity during electroosmotic flow. According to one aspect of the invention, a voltage applied to a gate electrode modulates flow velocity within an associated microchannel, where the gate voltage is separate from any voltage used to induce electroosmotic flow. According to another aspect of the invention, the flow control apparatus combines multiple gate electrodes to control flow in a microfluidic network. According to one embodiment of the invention, the flow control apparatus is fabricated in a planar silicon substrate. According to another embodiment of the invention, the flow control apparatus is fabricated using polymer materials.

US Patent:

20060019399, Jan 26, 2006

Filed:

Jul 1, 2005

Appl. No.:

11/171427

Inventors:

Brian Balgley - Annandale VA, US
Jonathan Cooper - Walkersville MD, US
Cheng Lee - Ellicott City MD, US
Donald DeVoe - Bethesda MD, US

International Classification:

G01N 33/00

US Classification:

436086000

Abstract:

Disclosed is a system for performing multiple analyses of protein and/or peptide samples and correlating the results of the analyses. The system comprises a sample inlet, a splitter means, at least two sample delivery capillaries, at least two sample deposition tools, and at least two sample collectors, wherein said splitter means is in fluid communication with the sample inlet and the sample delivery capillaries, and wherein liquid flow entering the splitter means is split into a number of sub-flows equal to the number of sample delivery capillaries. In one preferred embodiment, at least one microenzyme reactor is interfaced to a first sample delivery capillary in order to digest a protein sample within the capillary, while a second sample delivery capillary does not contain a microenzyme reactor, thereby enabling correlated analysis of the same protein sample in digested and undigested form. Methods for performing two or more analyses of protein and/or peptide samples and correlating the results of the analyses are also disclosed.

US Patent:

20060192107, Aug 31, 2006

Filed:

Oct 5, 2005

Appl. No.:

11/242842

Inventors:

Donald DeVoe - Bethesda MD, US
Yingxin Wang - Columbia MD, US
Cheng Lee - Ellicott City MD, US
Yan Li - Bethesda MD, US

International Classification:

B01D 59/44

US Classification:

250288000

Abstract:

Disclosed are an apparatus, system, and method for performing electrospray of biomolecules, particularly peptides, polypeptides, and proteins. The apparatus comprises at least (1) a microfluidic substrate for containing an electrospray microchannel for delivering analyte molecules to a side edge of the substrate, and (2) a porous membrane attached to the side edge for performing electrospray from the exposed membrane surface. In one preferred embodiment, the exposed membrane surface is positioned above a target surface for depositing analyte molecules onto the target surface by electrospray. In another preferred embodiment, a proteolytic enzyme is bound to the porous membrane for performing protein digestion during electrospray.

US Patent:

20110175789, Jul 21, 2011

Filed:

Nov 9, 2010

Appl. No.:

12/942932

Inventors:

Cheng Jung Lee - Santa Clara CA, US
Nhan Duc Nguyen - Oceanside CA, US
Ajay Gummalla - Sunnyvale CA, US

Assignee:

RAYSPAN CORPORATION - San Diego CA

International Classification:

H01Q 21/30
H04B 3/04
H01Q 1/36
H01Q 1/50

US Classification:

343853, 333 171, 343700 MS, 343850, 343876

Abstract:

Architectures and implementations of a transceiver system for wireless communications are presented, the system including one or more antennas supporting a single frequency band or multiple frequency bands, a transmit circuit, a receive circuit, and an isolation circuit that is coupled to the one or more antennas and the transmit and receive circuits and provides adequate isolation between the transmit circuit and the receive circuit.

US Patent:

53345371, Aug 2, 1994

Filed:

Nov 14, 1991

Appl. No.:

7/791309

Inventors:

Cheng S. Lee - Columbia MD
Ping Y. Huang - Baltimore MD

Assignee:

The University of Maryland - College Park MD

International Classification:

G01N 33543
G01N 33536

US Classification:

436518

Abstract:

The complexing of an antibody-antigen binding pair is determined by observing the change in fluorescence of a pH-sensitive fluorochrome attached to one of the members of the binding pair. When the binding is conducted in a solution having a pH other than the isoelectric point of the antibody, there will be a change in the pH of the microenviromnent surrounding the fluorochrome. This change will correspond to a change in the observed fluorescent intensity. Either member of the binding pair can be labeled, and combined with that member whose presence is suspect, in an immunoassay.

US Patent:

20230045521, Feb 9, 2023

Filed:

May 23, 2022

Appl. No.:

17/751199

Inventors:

- Palo Alto CA, US
Ray Tanaka - Palo Alto CA, US
Victor Chau - Palo Alto CA, US
Charles Feng - Palo Alto CA, US
Cheng Han Lee - Palo Alto CA, US
Lubab Al-Khawaja - Palo Alto CA, US

International Classification:

G06Q 20/32

Abstract:

Systems and methods for processing transactions using a digital payment platform.