Cheryl Y Richards

US Patent:

7829490, Nov 9, 2010

Filed:

Dec 14, 2006

Appl. No.:

11/610761

Inventors:

Hong Li - Sewickley PA, US
Cheryl A. Richards - Monroeville PA, US

Assignee:

PPG Industries Ohio, Inc. - Cleveland OH

International Classification:

C03C 3/091
C03C 13/00
C03C 13/06

US Classification:

501 66, 501 35, 501 36

Abstract:

Glass compositions are provided that are useful in electronic applications, e. g. , as reinforcements in printed circuit board substrates. Reduced dielectric constants are provided relative to E-glass, and fiber forming properties are provided that are more commercially practical than D-glass.

US Patent:

7989076, Aug 2, 2011

Filed:

Nov 20, 2007

Appl. No.:

11/986313

Inventors:

Hong Li - Sewickley PA, US
Robert A. Montague - Shelby NC, US
Cheryl A. Richards - Monroeville PA, US
Nikita Sergeevitch Shelekhov - St. Petersburg, RU
Natalia Aleksandrovna Kazachenok - St. Petersburg, RU

Assignee:

PPG Industries Ohio, Inc. - Cleveland OH

International Classification:

C08K 3/22
C08K 5/057
C08K 9/04
C09C 3/08

US Classification:

428461, 428457, 526 89

Abstract:

The present invention relates to materials comprising organic-inorganic polymeric networks. In some embodiments, the present invention provides an organic-inorganic composite material comprising an inorganic metal oxide matrix interpenetrating with a polymeric phase. Additionally, the present invention provides methods of producing organic-inorganic composite materials.

US Patent:

20060166805, Jul 27, 2006

Filed:

Aug 27, 2003

Appl. No.:

10/525899

Inventors:

Hong Li - Sewickley PA, US
Cheryl Richards - Monroeville PA, US
E. Cox - Cherryville NC, US

International Classification:

C03C 13/06
C03C 3/087

US Classification:

501036000, 501070000

Abstract:

An essentially fluoride-free, boron-containing fiber glass composition has a forming window greater than 50 C. and a forming temperature less than 1190 C., whereby it can substitute for conventional fluoride and boron-containing fiber glass composition without significantly changing operating parameters of the fiber forming process. The composition comprises: SiO50-54 weight percent, AlO12-15 percent, CaO 22-25 percent, MgO 1-4 percent, BO5-8 percent, NaO+KO less than 2 percent, FeO0.1-0.5 percent, Fless than 0.1 percent.

US Patent:

20110053755, Mar 3, 2011

Filed:

Nov 5, 2010

Appl. No.:

12/940764

Inventors:

Hong Li - Sewickley PA, US
Cheryl A. Richards - Monroeville PA, US

International Classification:

C03C 3/091
C03C 3/093
C03C 3/118

US Classification:

501 59, 501 66, 501 67

Abstract:

Glass compositions are provided that are useful in electronic applications, e.g., as reinforcements in printed circuit board substrates. Reduced dielectric constants are provided relative to E-glass, and fiber forming properties are provided that are more commercially practical than D-glass.

US Patent:

20120024578, Feb 2, 2012

Filed:

Jul 25, 2011

Appl. No.:

13/189836

Inventors:

Hong Li - Sewickley PA, US
Robert A. Montague - Shelby NC, US
Cheryl A. Richards - Monroeville PA, US
Nikita Sergeevitch Shelekhov - St. Petersburg, RU
Natalia Aleksandrovna Kazachonok - St. Petersburg, RU

Assignee:

PPG Industries Ohio, Inc. - Cleveland OH

International Classification:

H05K 1/03
C08L 67/06

US Classification:

174255, 525 55, 525308, 525242, 525311, 525298, 525279

Abstract:

The present invention relates to materials comprising organic-inorganic polymeric networks. In some embodiments, the present invention provides an organic-inorganic composite material comprising an inorganic metal oxide matrix interpenetrating with a polymeric phase. Additionally, the present invention provides methods of producing organic-inorganic composite materials.

US Patent:

20120058878, Mar 8, 2012

Filed:

Sep 9, 2011

Appl. No.:

13/229012

Inventors:

Hong Li - Sewickley PA, US
Cheryl A. Richards - Monroeville PA, US

International Classification:

C03C 13/02
C03C 13/00

US Classification:

501 38, 501 35

Abstract:

Glass compositions are provided that are useful in a variety of applications including, for example, electronics applications, reinforcement applications, and others. Some embodiments of glass compositions can provide desirable dielectric constants, desirable dissipation factors, and/or desirable mechanical properties while also having desirable fiber forming properties.