Chi Yeh Yu from Newark, CA, age 43

Automated Method Of Manufacturing Polyer Arrays
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US Patent:

20060088863, Apr 27, 2006
Filed:

Oct 4, 2005
Appl. No.:

11/243621
Inventors:

Melvin Yamamoto - Fremont CA, US
Clifford Oostman - Quilcene WA, US
John Sze - Saratoga CA, US
Keith Pearson - Campbell CA, US
Philip Trenholme - Santa Cruz CA, US
Dan Liu - Sunnyvale CA, US
Chi Yu - Saratoga CA, US
Assignee:

Affymetrix, INC. - Santa Clara CA
International Classification:

C12Q 1/68
H01L 29/15
C12M 1/34
H01L 31/0256
US Classification:

435006000, 435287200, 257076000
Abstract:

The present invention provides methods to process multiple sensors by providing a sensor plate and HT plates. In a preferred embodiment of the invention, methods for assembling microarray pegs and microarray plates are described for high throughput microarray processing.

Automated Method Of Manufacturing Polymer Arrays
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US Patent:

20060141612, Jun 29, 2006
Filed:

Feb 3, 2006
Appl. No.:

11/347654
Inventors:

Melvin Yamamoto - Fremont CA, US
Clifford Oostman - Quilcene WA, US
John Sze - Saratoga CA, US
Keith Pearson - Campbell CA, US
Philip Trenholme - Santa Cruz CA, US
Dan Liu - Sunnyvale CA, US
Chi Yu - Saratoga CA, US
Assignee:

Affymetrix, INC. - Santa Clara CA
International Classification:

C12M 1/34
H01L 21/00
US Classification:

435287200, 438001000
Abstract:

The present invention provides methods to process multiple sensors by providing a sensor plate and HT plates. In a preferred embodiment of the invention, methods for assembling microarray pegs and microarray plates are described for high throughput microarray processing.

Apparatuses, Systems And Methods For The Attachment Of Substrates To Supports With Light Curable Adhesives
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US Patent:

20120151746, Jun 21, 2012
Filed:

Dec 16, 2011
Appl. No.:

13/329170
Inventors:

John Mundaden - Pleasanton CA, US
Chi Sou Yu - Saratoga CA, US
Michael P. Mittmann - Palo Alto CA, US
Assignee:

AFFYMETRIX, INC. - Santa Clara CA
International Classification:

B23P 17/04
US Classification:

295271, 292811
Abstract:

Disclosed are apparatuses, systems and methods for attachment of substrates to supports. Disclosed are integrated pick-and-place curing apparatuses and systems and methods for using them. Integration of pick-and-place and curing functionalities provides higher efficiency and effectiveness compared to approaches which separate the two functions. Also disclosed are systems and methods for simultaneous attachment of a plurality of substrates to a support. Substrates include, within certain embodiments, arrays of biological polymers which are unaffected by the disclosed pick-and-place curing approaches.