Chih Hsuan Chou

US Patent:

20210402552, Dec 30, 2021

Filed:

Jul 17, 2020

Appl. No.:

16/932615

Inventors:

- Santa Clara CA, US
Hui Chen - San Jose CA, US
Chih Chung Chou - San Jose CA, US

International Classification:

B24B 37/015
B24B 37/34

Abstract:

A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.

US Patent:

20210046604, Feb 18, 2021

Filed:

Aug 10, 2020

Appl. No.:

16/989734

Inventors:

- Santa Clara CA, US
Chih Chung Chou - San Jose CA, US
Jianshe Tang - San Jose CA, US
Hui Chen - San Jose CA, US
Hari Soundararajan - Sunnyvale CA, US
Brian J. Brown - Palo Alto CA, US

International Classification:

B24B 37/015
H01L 21/321
H01L 21/67
B24B 57/02

Abstract:

A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.

US Patent:

20200376522, Dec 3, 2020

Filed:

May 28, 2020

Appl. No.:

16/886567

Inventors:

- Santa Clara CA, US
Jianshe Tang - San Jose CA, US
Hari Soundararajan - Sunnyvale CA, US
Hui Chen - San Jose CA, US
Chih Chung Chou - San Jose CA, US
Alexander John Fisher - Santa Clara CA, US
Paul D. Butterfield - San Jose CA, US

International Classification:

B08B 3/10
H01L 21/02
B08B 1/00
B24B 37/20
B24B 53/017

Abstract:

A method of cleaning for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto a component in the polishing system while the component is spaced away from a polishing pad of the polishing system to clean the component, and moving the component into contact with the polishing pad.

US Patent:

20200376523, Dec 3, 2020

Filed:

May 28, 2020

Appl. No.:

16/886571

Inventors:

- Santa Clara CA, US
Jianshe Tang - San Jose CA, US
Hari Soundararajan - Sunnyvale CA, US
Hui Chen - San Jose CA, US
Chih Chung Chou - San Jose CA, US
Alexander John Fisher - Santa Clara CA, US
Paul D. Butterfield - San Jose CA, US

International Classification:

B08B 3/10
H01L 21/67
B24B 37/34

Abstract:

An apparatus for steam treatment of a carrier head or a substrate in a chemical mechanical polishing system includes a load cup, a pedestal in a cavity defined by the load cup, the pedestal configured to receive a substrate from or supply a substrate to a carrier head, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into the cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

US Patent:

20200376626, Dec 3, 2020

Filed:

May 28, 2020

Appl. No.:

16/886238

Inventors:

- Santa Clara CA, US
Jianshe Tang - San Jose CA, US
Hari Soundararajan - Sunnyvale CA, US
Paul D. Butterfield - San Jose CA, US
Hui Chen - San Jose CA, US
Chih Chung Chou - San Jose CA, US
Alexander John Fisher - Santa Clara CA, US

International Classification:

B24B 53/017
B24B 57/02
B24B 53/00

Abstract:

A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

US Patent:

20200282506, Sep 10, 2020

Filed:

May 22, 2020

Appl. No.:

16/882154

Inventors:

- Santa Clara CA, US
Chih Chung CHOU - San Jose CA, US
Charles C. GARRETSON - Sunnyvale CA, US
Jeonghoon OH - Saratoga CA, US
King Yi HEUNG - Union City CA, US

International Classification:

B24B 7/22
B24B 13/005
B24B 37/07
B24B 49/10
H01L 21/3105
H01L 21/321

Abstract:

A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.

US Patent:

20200070306, Mar 5, 2020

Filed:

Jul 25, 2019

Appl. No.:

16/522287

Inventors:

Nicholas Wiswell - Sunnyvale CA, US
Chih Chung Chou - San Jose CA, US
Dominic J. Benvegnu - La Honda CA, US

International Classification:

B24B 49/12
B24B 37/013
B24B 37/04

Abstract:

A chemical mechanical polishing system includes a platen to support a polishing pad, a carrier head to hold a substrate and bring a lower surface of the substrate into contact with the polishing pad, and an in-situ friction monitoring system including a friction sensor. The friction sensor includes a pad portion having a substrate contacting portion with an upper surface to contact the lower surface of the substrate, and a pair of capacitive sensors positioned below and on opposing sides of the substrate contacting portion.

US Patent:

20190283204, Sep 19, 2019

Filed:

Mar 13, 2019

Appl. No.:

16/351954

Inventors:

- Santa Clara CA, US
Dominic J. Benvegnu - La Honda CA, US
Chih Chung Chou - San Jose CA, US
Nicholas Wiswell - Sunnyvale CA, US
Thomas H. Osterheld - Mountain View CA, US
Jeonghoon Oh - Saratoga CA, US

International Classification:

B24B 37/013
B24B 49/12
B24B 37/04
H01L 21/66

Abstract:

A chemical mechanical polishing apparatus includes a platen to support a polishing pad, the platen having a recess, a flexible membrane in the recess, and an in-situ vibration monitoring system to generate a signal. The in-situ acoustic monitoring system includes a vibration sensor supported by the flexible membrane and positioned to couple to an underside of the polishing pad.